Implementing Fan-Out Wafer-Level Packaging with Mentor Graphics

What is FO-WLP, who needs it, and what are the limitations?

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Fan-out wafer-level packaging (FOWLP) is a new high-density packaging technology that is rapidly gaining popularity. What is it? Who needs it? How do you take advantage of it? What limitations does it have? Learn all about FOWLP and our comprehensive tool integration and support for the design and verification of FOWLP products.

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