The Week In Review: Manufacturing


For years, China has been trying to get a domestic IC equipment industry off the ground, but it has experienced modest success in the arena. Now, China may take a new strategy—acquire fab tool makers. In what could be a sign of things to come, China’s Beijing E-Town Dragon Semiconductor Industry Investment Center has entered into a definitive agreement to acquire U.S.-based fab tool vendor ... » read more

Making Flexible OLED Displays


Organic light-emitting diodes (OLEDs) are supposedly the next big thing in display technology. In fact, over the years, several display makers have spent billions of dollars to build new and large OLED fabs. To be sure, OLEDs enable brighter displays, as compared to traditional LCD technology. OLEDs use a series of thin, light-emitting films, which enables the display to produce brighter li... » read more

The Week In Review: Manufacturing


After several delays due to a myriad of complex regulatory issues, Applied Materials’ proposed deal to buy Tokyo Electron Ltd. (TEL) has been scrapped. Now, Applied Materials and TEL are separately re-grouping, and are back to where they originally started as competitors in the fab tool market. Applied Materials held a conference call to explain the situation with TEL. Applied Materials... » read more

More Lithography Options?


Lithographers face some tough decisions at 10nm and beyond. At these nodes, IC makers are still weighing the various patterning options. And to make it even more difficult, lithographers could soon have some new, and potentially disruptive, options on the table. On one front, the traditional next-generation lithography (NGL) technologies are finally making some noticeable progress. For examp... » read more

The Week In Review: Manufacturing


This week, IBM began to cut jobs amid lackluster results. Big Blue is also in the process of selling its chip unit to GlobalFoundries. GlobalFoundries said the jobs are safe at IBM Micro, at least for now, according to a report the Press and Sun-Bulletin. What’s the latest with Applied Materials’ proposed acquisition with Tokyo Electron Ltd. (TEL)? “Germany, Israel and Singapore approv... » read more

The Week In Review: Manufacturing


Jimmy Kimmel, comedian and late night host of Jimmy Kimmel Live, replaces Lily Collins (Mirror, Mirror) as McAfee’s most dangerous celebrity to search for online. Cybercriminals are looking for ways to take advantage of consumer interest around popular cultural events. These criminals capitalize on the public’s fascination with celebrities to lure them to sites laden with malware, which ena... » read more

Manufacturing Bits: July 8


Intel foundry deal At the Semicon West trade show in San Francisco, Intel announced that it has entered into a foundry agreement with Panasonic’s LSI Business Division. Intel's custom foundry business will manufacture future Panasonic system-on-chips (SoCs) using Intel's 14nm low-power manufacturing process. Intel’s low-power process will be a derivative of its general-purpose 14nm proc... » read more

The Week In Review: Manufacturing


Looking to address a new wave of chip architectures in the marketplace, Applied Materials has rolled out its next-generation, medium-current ion implanter. The system, dubbed the VIISta 900 3D, is geared for the production of finFETs and 3D NAND designs at the sub-2xnm nodes. Typically, medium-current implanters have a maximum energy range of about 900keV (triple-charge), with dose ranges fr... » read more

The Week In Review: Manufacturing


IC Insights has released its rankings of the Q1 ‘14 top 25 semiconductor suppliers. Outside of the top five spots, there were numerous changes. MediaTek jumped up four positions. Also, last year’s Micron/Elpida merger created a new giant semiconductor company with Micron’s sales expected to be over $17 billion this year. Toshiba will demolish the No. 2 semiconductor fabrication facilit... » read more

Cobalt To The Rescue


A big concern for chipmakers is a key part of the manufacturing flow—the backend-of-the-line (BEOL). In chip production, the BEOL is where the interconnects are formed within a device. Interconnects, those tiny wiring schemes in devices, are becoming more compact at each node. This, in turn, is causing a degradation in performance and an increase in the dreaded resistance-capacitance (RC) ... » read more

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