Advanced packaging shifts to mainstream with complete flows, better tools, market proof points.

Transition from planar to 3D NAND is harder and more time-consuming than expected.

LiDAR firms attract investments as corporate and venture investors vie for a piece of this burgeoning market.

The 40nm gate-pitch cliff, 3D SoCs with microfluidic cooling, new fan-outs and 2.5D—it’s all on the table.

Different materials, approaches for contacts and interconnects begin to surface for 7/5nm.

Chip industry repositions as technology begins to take shape; no clear winners yet.

As the market for artificial intelligence heats up, so does confusion about how to build these systems.

Proponents tout freedom for computing architectures, but is the semiconductor ecosystem ready for open-source hardware?

Part 2: Heterogeneity and architectures become focus as scaling benefits shrink; IP availability may be problematic.

Technology begins to twist in different directions and for different markets.

Andes IPO; automotive physical IP; energy processing unit; PCIe with AXI bridge; certifications and IP for TSMC 7, 12nm.

Adding more dimensions creates more data, all of which needs to be processed using new architectural approaches.

Experts at the table, part 1: What the toolchain looks like today and the different mindsets within those flows.