Measuring FinFETs Will Get Harder

The industry is gradually migrating toward chips based on finFET transistors at 16nm/14nm and beyond, but manufacturing those finFETs is proving to be a daunting challenge in the fab. Patterning is the most difficult process for finFETs. But another process, metrology, is fast becoming one of the biggest challenges for the next-generation transistor technology. In fact, [getkc id="252" kc_n... » read more

The Week In Review: Manufacturing

Is the sky falling in the IC equipment market? Not yet, but watch out below. Semi capital spending is expected to reach $60.37 billion in 2015, down 1% from 2014, according to Pacific Crest Securities. “Although we trimmed 2016 capex three weeks ago, we are trimming some more. We now see semiconductor capex down 4% in 2016. However, we do not see capex falling off a cliff in 2016 (i.e., down ... » read more