3D-IC Testing With The Mentor Graphics Tessent Platform

Testing interposer-based versions of stacked die and future versions using through-silicon vias.

popularity

Three-dimensional stacked integrated circuits (3D-ICs) are composed of multiple stacked die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration and interconnect methods include wirebond and flip-chip and have been in production for some time.

3D chips connected via interposers are in production at Xilinx, Samsung, IBM, and Sematech [1]. Interposers are providing the logical first step to industrialization of 3D based on through-silicon vias (TSV)s. The next generation of 3D integration incorporates TSV technology as the primary method of interconnect between the die.

To download this white paper, click here.