End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within heterogeneous systems.
Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost.
Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable seamless IC/package co-design.
Discover how a new RF platform accelerates RFIC/MMIC design and heterogeneous integration.
You’ll learn how to:
Read more here.
Fig.1: Heterogeneous integration solution for RF system design. Source: Cadence
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