A New RF Platform For Silicon MMIC And System Design

End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within heterogeneous systems.

popularity

Next generation wireless modules combine innovative and proven RFIC/MMIC designs into a single package―delivering superior performance, lower power consumption, and reduced size, weight, and cost.

Advanced system engineering plays a crucial role in this progress, with a strong focus on packaging interconnect design, RF analysis, and thermal and electromagnetic (EM) awareness that enable seamless IC/package co-design.

Discover how a new RF platform accelerates RFIC/MMIC design and heterogeneous integration.

You’ll learn how to:

  • Leverage concurrent RF/physical design entry for faster design cycles
  • Use simulation and optimization to enhance performance
  • Perform in-design EM and thermal analyses for greater design accuracy
  • Achieve seamless co-design across silicon, laminate, and system domains

Read more here.

 

Fig.1: Heterogeneous integration solution for RF system design. Source: Cadence



Leave a Reply


(Note: This name will be displayed publicly)