How to model change of copper film properties and what are the proper methods for low-k film thickness measurements in each CMP step.
This paper describes a method to effectively monitor the film stack at different metal CMP process steps using a spectroscopic ellipsometer metrology tool. By proper modeling of the Cu dispersion and simulating the underlayer film information underneath the Cu pad, a single measurement recipe was developed which can be used to monitor each process step in the metal CMP process with stable and reliable results.
To read more, click here.
 |
 |
 |
 |
 |
 |
 |
 |
 |
