Design platforms that provide seamlessly integrated EM and multiphysics/thermal simulation with the capacity to solve large-scale design and integration problems across IC, package, and board, to address advanced system integration.
With the move toward higher frequencies and component densities, RF/mixed signal PCB systems and heterogeneous system-in-package (SiP) technologies are increasingly susceptible to delayed product development turnaround times that threaten delivery schedules. These delays often occur late in development during integration when components that met the design specifications fail to achieve the required system performance collectively. Systems are especially at risk in cases where higher levels of integration, shrinking system footprints, and the move to higher frequencies lead to increased electromagnetic (EM) coupling, as well as electrothermal concerns resulting from the power dissipation of densely packed electronics.
This paper overviews the Cadence design platforms that address this growing problem by providing seamlessly integrated EM and multiphysics/thermal simulation with the capacity to solve large-scale design and integration problems across IC, package, and board, to address advanced system integration. In addition, groundbreaking cross-platform interoperability between the Cadence® AWR Design Environment® platform for RF/microwave design, the industry-leading Virtuoso® design platform for RFIC/SiP design, and the Allegro® platform for PCB and IC package design supports RF to millimeter-wave (mmWave) intellectual property (RF IP) integration across heterogeneous technologies.
Author: David Vye
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