Author's Latest Posts


Verifying Scale-Up And Scale-Out In Data Centers


Semiconductor Engineering sat down to discuss challenges and solutions for data center build-out and build-up with Gordon Allan, Siemens EDA director of verification IP; Rishi Chugh, vice president of product marketing for network switching at Marvell; Saravanan Kalinagasamy, senior director of ASIC design and validation at Astera Labs; and Jalaj Gupta, product engineering lead at Siemens EDA. ... » read more

New Performance Requirements For Audio


Demand for higher performance in audio is rising as human-machine interactions increase on the edge. That means more processing elements, and more challenges in keeping data consistent across those processors. Prakash Madhvapathy, director of product marketing and product management at Cadence, talks about the advantages of coherent designs, how that impacts security, and how DSPs are evolving ... » read more

Wi-Fi 7 Moves To The IoT


Wi-Fi 7 has been a staple in high-end applications such as notebook computers and AR/VR glasses for the past couple years, where high-speed connectivity and low latency are essential. Known alternatively as IEEE 802.11be, and Extremely High Throughput Wi-Fi, it is starting to migrate downstream into IoT devices such as smart door locks, thermostats, and robotic vacuum cleaners. But the reason i... » read more

The Race Begins For Much Bigger Abstractions In Data Centers


Key Takeaways Data center build-out is enabling much larger and more complex abstractions. Competition is building for digital/virtual twins across multiple industry segments, including automotive, aerospace, and chip manufacturing. AI, and particularly AI agents, will play a significant role in sorting through data to find potential trouble spots. The frenzy of new data cen... » read more

One-on-One With proteanTecs CEO Shai Cohen


The acceleration of technology is unprecedented: AI data centers, edge build-out, robotics, photonics, quantum, multi-die assemblies. Semiconductor Engineering Editor in Chief Ed Sperling talks with proteanTecs CEO Shai Cohen about what's changing and what impact it will have. Click here to listen. » read more

Changes In Chip Architectures At The Edge


Edge computing is all about low latency, within a tight power budget, and with sufficient performance. This is very different from an AI data center, where the real focus is on data throughput between processor and memory. Achieving those goals requires a focus on what different processing elements bring to the table. Nigel Drego, co-founder and CTO of Quadric, talks about how these different c... » read more

Why Move To 2nm?


Key Takeaways: Scaling digital logic still provides significant benefits, especially lower power. Multi-die assemblies will be the predominant approach, and most of the circuitry will not be 2nm or below. While these systems are inherently more flexible, the number and complexity of tradeoffs required for optimizing PPA/C are increasing. The rollout of 2nm process nodes and ... » read more

Agentic AI In Chip Manufacturing


Agentic AI — breaking AI into individual agents that can work together and collaboratively — will be the real game changer for AI in chip manufacturing. By taking humans out of the loop, these agents can be programmed using natural language to automatically solve problems and improve efficiency. Jon Herlocker, vice president and general manager of software analytics at Cohu, talks  about w... » read more

Software-Defined Systems


Using high-level software languages to define semiconductors is faster, easier, and allows for more changes long before the RTL stage. This is especially useful for chiplets and embedded accelerators, which are narrower in scope and more targeted at different workloads and specific domains. But there are some caveats for engineers working in this space. Russell Klein, program director for Sieme... » read more

Big Changes Ahead For Semiconductor Manufacturing


John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering's Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly. To listen, click here.   » read more

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