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Fill Challenge Solved: Why SmartFill is as Good as it Sounds


by Jean-Marie Brunet Among the many steps involved with chip design, there is one known by the deceptively simple name of “fill.” Fill involves adding shapes or polygons to the design that are structural, not logical. That is, they ensure manufacturability by making sure each layer (metal, poly, diffusion) has a proscribed density. As easy as this sounds, fill can be tricky, and the fill... » read more

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