Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

450mm Silicon Wafer Issues Emerge

By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus The most critical component in semiconductor manufacturing is arguably the silicon wafer, but the substrate is often taken for granted in the supply chain. After all, silicon wafer makers have nearly perfected their craft over the years and produce what many consider mere commodities. And on the business front, silicon wafer makers often find themselves with excess capacity... » read more

It’s A Materials World

By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus At a recent event, Intel’s fab materials guru described a nightmarish occurrence that nearly brought the chip giant to its knees. Tim Hendry, director of fab materials and vice president of the Technology and Manufacturing Group at Intel, said the company obtained a critical material from an undisclosed supplier. “This large sub-supplier, a very large chemical company, m... » read more

China Foundries Seek Niches

By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus For decades, China has launched several initiatives to modernize its semiconductor industry with hopes of becoming the next IC powerhouse in Asia. In 2001, for example, China unveiled its so-called "Tenth Five-Year Plan," which called for the nation to build 25 new fabs from 2001 to 2005. At the time, the Chinese government hoped to start and fund a new crop of domestic fou... » read more

Manufacturing Bits: Aug. 13

By Mark LaPedus - 13 Aug, 2013 - Comments: 0

Crawling And Climbing Robots The field of autonomous robotics is generating interest, as these systems can explore areas and perform functions that are risky and inaccessible to humans. The University of California at San Diego and EPFL separately have developed new autonomous robots for a range of applications. For example, UC San Diego has developed a robot designed to scoot along utility... » read more

Experts At The Table: 450mm Fab And Facilities Challenges

By Mark LaPedus - 09 Aug, 2013 - Comments: 0

Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab Solutions Business ... » read more

Experts At The Table: 450mm Fab And Facilities Challenges

By Mark LaPedus - 02 Aug, 2013 - Comments: 0

Manufacturing Bits: July 23

By Mark LaPedus - 23 Jul, 2013 - Comments: 0

Space Tubes In 2011, NASA produced a material that absorbs on average more than 99% of the ultraviolet, visible, infrared, and far-infrared light that hits it. NASA’s so-called “super-black” material is based on a thin layer of multi-walled carbon nanotubes. Tiny gaps between the nanotubes collect and trap light. The carbon absorbs the photons, preventing them from reflecting off surf... » read more

The Week In Review: July 22

By Mark LaPedus - 22 Jul, 2013 - Comments: 0

By Mark LaPedus ASML Holding has been under pressure to bring extreme ultraviolet (EUV) lithography into mass production. EUV is still delayed. Now, in their latest roadmaps, leading-edge chipmakers are counting on ASML’s 300mm EUV scanner for insertion at the 10nm node. Yet, at the same time, ASML also is working on a 450mm version of the EUV tool. “EUV (on 300mm) is a higher priority th... » read more

Experts At The Table: 450mm Fab And Facilities Challenges

By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab S... » read more

Foundries Eye 300mm Analog Fabs

By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus In 2009, Texas Instruments changed the semiconductor landscape when it opened the industry’s first 300mm fab for analog chips. Until then, analog chip production was conducted in fabs at 200mm wafer sizes and below. With a 300mm fab, TI potentially could gain a die-size and cost advantage over its analog rivals. On paper, a 300mm wafer provides 2.5 times more chips than a... » read more

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