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CHERI RISC-V: HW Extension for Conditional Capabilities
By Technical Paper Link - 28 Jul, 2024 - Comments: 0

A technical paper titled “Mon CHÈRI <3 Adapting Capability Hardware Enhanced RISC with Conditional Capabilities” was published by researchers at Ericsson Security Research, Université Libre de Bruxelles, and KU Leuven. Abstract: "Up to 10% of memory-safety vulnerabilities in languages like C and C++ stem from uninitialized variables. This work addresses the prevalence and lack of ade... » read more

Using Diffusion Models to Generate Chip Placements (UC Berkeley)
By Technical Paper Link - 27 Jul, 2024 - Comments: 0

A technical paper titled “Chip Placement with Diffusion” was published by researchers at UC Berkeley. Abstract: "Macro placement is a vital step in digital circuit design that defines the physical location of large collections of components, known as macros, on a 2-dimensional chip. The physical layout obtained during placement determines key performance metrics of the chip, such as power... » read more

Formal Verification of Security Properties On RTL Designs
By Technical Paper Link - 27 Jul, 2024 - Comments: 0

A technical paper titled “RTL Verification for Secure Speculation Using Contract Shadow Logic” was published by researchers at Princeton University, MIT CSAIL, and EPFL. Abstract: "Modern out-of-order processors face speculative execution attacks. Despite various proposed software and hardware mitigations to prevent such attacks, new attacks keep arising from unknown vulnerabilities. Thus... » read more

Ultrafast Charge Transfer Cascade In Semiconductor Materials
By Technical Paper Link - 27 Jul, 2024 - Comments: 0

A technical paper titled “Ultrafast Charge Transfer Cascade in a Mixed-Dimensionality Nanoscale Trilayer” was published by researchers at the National Renewable Energy Laboratory. Abstract: "Innovation in optoelectronic semiconductor devices is driven by a fundamental understanding of how to move charges and/or excitons (electron-hole pairs) in specified directions for doing useful work, ... » read more

Battery Electronification: Intracell Actuation And Thermal Management (Penn State, EC Power)
By Technical Paper Link - 27 Jul, 2024 - Comments: 0

A technical paper titled “Battery electronification: intracell actuation and thermal management” was published by researchers at Pennsylvania State University and EC Power. Abstract: "Electrochemical batteries – essential to vehicle electrification and renewable energy storage – have ever-present reaction interfaces that require compromise among power, energy, lifetime, and safety. He... » read more

Survey of CXL Implementations and Standards (Intel, Microsoft)
By Technical Paper Link - 22 Jul, 2024 - Comments: 0

A new technical paper titled "An Introduction to the Compute Express Link (CXL) Interconnect" was published by researchers at Intel Corporation, Microsoft, and University of Washington. Abstract "The Compute Express Link (CXL) is an open industry-standard interconnect between processors and devices such as accelerators, memory buffers, smart network interfaces, persistent memory, and solid-... » read more

Improving Performance and Power Efficiency By Safely Eliminating Load Instruction Execution (ETH Zürich, Intel)
By Technical Paper Link - 22 Jul, 2024 - Comments: 0

A technical paper titled “Constable: Improving Performance and Power Efficiency by Safely Eliminating Load Instruction Execution” was published by researchers at ETH Zürich and Intel Corporation.  This paper earned the Best Paper Award in the International Symposium on Computer Architecture (ISCA). Abstract: "Load instructions often limit instruction-level parallelism (ILP) in modern pr... » read more

SiC Power Electronics Packaging: Floating Die Structure and Liquid Metal Fluidic Connection (Cambridge U. )
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging" was published by researchers at Cambridge University. Abstract "Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electroni... » read more

HW Security: Flip-Flops Along Logic Gates to Prevent Synthesis Tools’ Structural Leakages (TU Dresden, Ruhr Univ. Bochum)
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Flip-Lock: A Flip-Flop-Based Logic Locking Technique for Thwarting ML-based and Algorithmic Structural Attacks" was published by researchers at TU Dresden and Ruhr University Bochum. Abstract "Machine learning (ML) and algorithmic structural attacks have highlighted the possibility of utilizing structural leakages of an obfuscated circuit to reverse engineer th... » read more

Functional Compaction for Functional Test Sequences (Purdue University, I. Pomeranz)
By Technical Paper Link - 17 Jul, 2024 - Comments: 0

A new technical paper titled "Functional Compaction for Functional Test Sequences" was published by IEEE Fellow Irith Pomeranz at Purdue University. Abstract: "The occurrence of silent data corruption because of hardware defects in large scale data centers points to the advantages of applying functional test sequences to detect hardware defects that escape scan-based tests. When using funct... » read more

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