Blog Review: Feb. 20

Compression for 8k displays; silicon photonics; sensor accuracy enables new applications; embedded development platforms.


Synopsys’ Chirag Tyagi examines how Display Stream Compression 1.2 allows the commonly used MIPI DSI display interface to support 8k UHD displays in applications like infotainment and AR/VR even with the limited bandwidth of PHY layers.

Cadence’s Paul McLellan listens in on a panel discussion at DesignCon on how to create PDKs for silicon photonics so non-photonics experts can complete at least basic designs.

Mentor’s John Ferguson contends that for silicon photonics to be widely adopted, a range of resources including tools, libraries, and manufacturing processes are needed to standardize and automate photonics design and verification flows.

SEMI’s Maria Vetrano chats with Andrea Onetti of STMicroelectronics about how the improved accuracy of MEMS sensors is impacting a range of applications, from industrial asset tracking to consumer electronics.

Arm’s Zach Lasiuk presents an overview of software and hardware platform options for embedded software development and which platforms can help reveal certain types of software bugs.

NXP’s Sami Nassar argues that if security is not integral to devices and a smart city’s system architecture, the safety and stability of vital city operations and privacy of citizens will be at risk.

A Rambus writer warns that the three main signal integrity losses of insertion loss, reflections, and crosstalk are only tip of the iceberg when it comes to GDDR6 DRAM signal integrity issues.

Nvidia’s Scott Martin explains transfer learning, a deep learning technique that takes a neural network trained for one task and applies it to another domain that may not have as much data available.

ANSYS’ Mark Ravenstahl observes that reliability was a major focus at this year’s DesignCon, with automotive and 5G also topics of interest.

Agnisys’ Louie De Luna explains how the company is using machine learning to predict register descriptions by identifying patterns in plain text written in simple English.

And don’t miss the blogs featured in the latest Low Power-High Performance and Packaging, Test & Materials newsletters:

Editor In Chief Ed Sperling contends that processing speed is now a geopolitical issue, which could help solve one of the thorniest problems in computing.

Rambus’ Frank Ferro explains why a new memory standard is so critical for everything from AI to ADAS.

Synopsys’ Gary Ruggles helps you understand the gotchas in moving to PCIe 5.0.

Mentor’s Hossam Sarhan and Alexandre Arriordaz demonstrate how to achieve better performance reliability in analog circuits.

Moortec’s Ramsay Allen muses about what a difference a few degrees can make.

Editor in Chief Ed Sperling argues that automakers are right to demand quality, but wrong in their approach.

Semiconductor Engineering’s Katherine Derbyshire predicts that the kitchen will be the next frontier for robots.

National Instruments’ Milton Lien and David Vye explain why creating automotive radar applications for mmWave demands special tools.

Advantest’s Judy Davies looks at what’s needed to measure device performance and reliability in next-gen wireless.

OptimalPlus’ Sharon Shafran explains how to extend test data analytics capabilities and capacity.

Electronic System Design Alliance’s Bob Smith prepares for ES Design West.

Rambus security advisor Paul Kocher points to new vulnerabilities around software techniques that damage hardware.

DAC Infrastructure Chair Derek Magill looks at the good and bad of moving data to the cloud.

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