Blog Review: July 26

Siemens’ Chris Spear shows how to make a group of specialized classes in SystemVerilog.

Synopsys’ Guy Cortez and Randy Fish consider what a silicon lifecycle management strategy looks like for SoCs deployed in HPC and data center environments.

Cadence’s Veena Parthan provides a primer on writing Python scripts for Fidelity, including API descriptions and different sets of packages to accessing entities in the geometry tree.

Codasip’s Tariq Kurd argues for reducing RISC-V code size to optimize total system cost, power dissipation, and performance by using the Zc extensions that add short 16-bit instruction encodings for common operations.

Keysight’s Shawn Lee discusses the significance of IoT device battery testing and how battery emulation and profiling software plays a crucial role.

Ansys’ Akanksha Soni shares several techniques for reducing the power consumption of ICs, such as clock, power, and frequency gating, and notes some of the design challenges involved.

Arm’s David Maidment highlights trends from the PSA Certified 2023 Security report, including views on potential security regulation.

Renesas’ Graeme Clark examines using ECC to correct soft errors in SRAM in microcontrollers.

SEMI’s Heidi Hoffman checks out a company developing conductive inks optimized to enable the printing of finer pitches on flexible and 3D printed circuit structures than possible with conventional polymer thick film inks.

Plus, check out the blogs featured in the latest Low Power-High Performance and Manufacturing, Packaging & Materials newsletters:

Synopsys’ Madhumita Sanyal argues that as data rates escalate, so does the need for more advanced signal processing capabilities.

Fraunhofer IIS/EAS’ Benjamin Prautsch shows why the lack of abstraction is hindering the automation of analog design.

Rambus’ Frank Ferro proposes a route for meeting the memory bandwidth and capacity demands of large language models.

Quadric’s Steve Roddy explains how to span the chasm between data scientist and embedded programmer.

Ansys’ Akanksha Soni examines the interplay between current density, temperature, and material properties in mitigating electromigration.

Arm’s David Lecomber looks at reducing the cost of running CFD software for aerodynamics, molecular dynamics, weather prediction, and crash simulation.

Cadence’s Vinod Khera digs into how SLAM and AI ISPs help improve robot navigation in unfamiliar environments and adverse conditions.

Siemens’ Jeff Wilson explores correct-by-construction and DRC-clean layout modifications.

Amkor’s Eoin O’Toole introduces a platform for assembly of multiple fan-out wafers or subpanels on a carrier panel with reduced cost in the RDL process.

Lam Research’s Sumant Sarkar evaluates the tradeoffs between residual SiGe, silicon over-etching, and channel width in GAA fabrication.

Bmbg Consult’s Jan Hendrik Peters and Vistec Electron Beam’s Ines Stolberg look at key trends in building fabs and patterning masks from The European Mask and Lithography Conference 2023.

SEMI’s Cassandra Melvin shows why the stars are finally aligning for 3D semiconductor systems.