The Week in Review: IoT
By Jeff Dorsch - 01 Jun, 2018 - Comments: 0

Finance SenseTime of Beijing, China, received $620 million in Series C+ funding, valuing the company at more than $4.5 billion. Alibaba Group led the new funding, as it did with last month’s Series C round of $600 million. Qualcomm, an existing investor, participated in the latest round, along with new investors Fidelity International, Hopu Capital, Silver Lake Partners, and Tiger Global. Se... » read more

The Week In Review: Design
By Jesse Allen - 01 Jun, 2018 - Comments: 0

Tools Real Intent launched Verix SimFix, an intent-driven verification solution for gate-level simulation (GLS) of digital designs designed to eliminate X-pessimism. SimFix uses mathematical methods to identify conditions under which pessimism can occur, and to determine the correct value when those conditions occur. It then generates files to use in simulation that detect and correct pessimis... » read more

The Week In Review: Manufacturing
By Ed Sperling - 01 Jun, 2018 - Comments: 0

Cleanliness is a good thing. In the fab, it's also a very profitable thing. According to a report from Research and Markets, the wafer cleaning systems market will grow more than 6%. The research house notes, however, that the rate of growth is slowing. GlobalFoundries began volume production of its 180nm ultra-high-voltage process for industrial and power applications. The base platform sta... » read more

Ensuring Chip Reliability From The Inside
By Ann Mutschler - 31 May, 2018 - Comments: 0

Monitoring activity and traffic is emerging as an essential ingredient in complex, heterogeneous chips used in automotive, industrial, and data center applications. This is particularly true in safety-critical applications such as automotive, where much depends on the system operating exactly right at all times. To make autonomous and assisted driving possible, a mechanism to ensure systems ... » read more

What’s In A Node?
By Sundeep Bajikar - 30 May, 2018 - Comments: 0

In an environment where process nodes are no longer consistently delivering the level of improvements predicted by Moore’s Law, the industry will continue to develop “inter-nodes” as a way to deliver incremental improvements in lieu of “full-nodes.” A shift in market requirements, in part due to the rise of AI and IoT, is increasing emphasis on trailing-nodes. When it comes to leading... » read more

IIoT And Predictive Maintenance
By Jeff Dorsch - 30 May, 2018 - Comments: 1

It’s every production line manager’s nightmare—some machinery breaks down, stopping production on the factory floor. In a fab, if just one piece of semiconductor manufacturing equipment goes down and is out of service for hours, wafer fabrication can grind to a halt. Such shutdowns are expensive, especially if the plant is operating on a 24-hour schedule to meet demand. One selling poi... » read more

Transistor-Level Performance Evaluation Based On Wafer-Level Process Modeling
By Michael Hargrove - 30 May, 2018 - Comments: 0

Three years ago, I wrote a blog entitled “Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation,” in which I described the seamless connection between the SEMulator3D virtual wafer fabrication software platform and external third-party TCAD software. I’m now happy to report that device-level I-V performance analysis is now a built-in module within the SEMulator3D so... » read more

Understanding The Effect Of Variability In Bulk FinFET Device Performance
By Coventor - 30 May, 2018 - Comments: 0

2-D MOSFETs have proven difficult to scale down to 20nm and beyond. In their place, 3D FinFET transistors have emerged as novel devices that can scale down to lower node sizes. 10nm process finFETs are for SoC product mass production, and research is progressing towards a 7nm process finFET. FinFET transistors provide lower dynamic power consumption (due to flatter I-V curves), improved control... » read more

Blog Review: May 30
By Jesse Allen - 30 May, 2018 - Comments: 0

Cadence's Paul McLellan listens in as Krste Asanović explains the history of AI and the birth of neural networks, the role of GPUs, and challenges for the future. Synopsys' Amit Tyagi examines high speed memory interfaces with a look at the basic operations of Toggle3NAND/Toggle2NAND and how they delivers higher performance at lower power consumption. Mentor's Mike Santarini chats with A... » read more

Manufacturing Bits: May 29
By Ed Sperling - 29 May, 2018 - Comments: 0

Utilizing Heat For Energy One of the big problems in electronics in general, and semiconductors particular, is heat. And it's not just about leakage current anymore. Heat is a problem at every level, from circuit design to the materials being used inside the chips, as well as warpage between die caused by heat after they are packaged together. Heat can prematurely age chips as well as destroy ... » read more

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