Imperfect Silicon, Near-Perfect Security
By Kevin Fogarty - 07 Feb, 2018 - Comments: 0

Some chipmakers, under pressure to add security to rapidly growing numbers of IoT devices, have rediscovered a "fingerprinting" technique used primarily as an anti-counterfeiting measure. [getkc id="227" kc_name="Physically unclonable functions"] (PUFs) are used to assign a unique identification number based on inconsistencies in the speed with which current causes a series of logic gates to... » read more

Manufacturing Bits: Feb. 6
By Mark LaPedus - 06 Feb, 2018 - Comments: 0

GaN trusted foundry HRL Laboratories--an R&D venture between Boeing and General Motors--has launched a new foundry service for use in advanced millimeter-wave (mmWave) gallium-nitride (GaN) technology applications. HRL’s process, called T3-GaN, is a high-electron-mobility transistor technology. It will enable the fabrication of GaN-based monolithic microwave integrated circuits (MMICs... » read more

System Bits: Feb. 6
By Ann Mutschler - 06 Feb, 2018 - Comments: 0

Compressing data in vehicles As the number of cameras in automobiles is on the rise with the move to autonomous vehicles, internal vehicle networks are being pushed to their limits from the flood of data. While special compression methods reduce the amount of video data, they also exhibit a high degree of latency for coding. But now, Fraunhofer researchers have adapted video compression in su... » read more

DAC’s Passageway To Design Infrastructure
By Bob Smith - 06 Feb, 2018 - Comments: 0

This year's Design Automation Conference will include an "alley" on the exhibit floor, but it won't be a dark, narrow passageway we think of when we hear "alley." Instead, the new Design Infrastructure Alley will be a well-illuminated tribute to the design technology infrastructure, a fundamental element for the creation and design of complex electronic systems and components. The Design Inf... » read more

Power/Performance Bits: Feb. 6
By Jesse Allen - 06 Feb, 2018 - Comments: 0

Recycling cathodes Nanoengineers at the University of California San Diego developed an energy-efficient recycling process that restores used cathodes from spent lithium ion batteries. The process involves harvesting the degraded cathode particles from a used battery and then boiling and heat treating them. In new batteries built with the cathodes, charge storage capacity, charging time and ba... » read more

What’s In The Package?
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Putting a variety of chips or hardened IP blocks into a package rather than trying to cram them into a single chip continues to gain ground. But it's also creating its own set of issues around verifying and testing these devices. This problem is well understood inside of SoCs, where everything is integrated into a single die. And looked at from a 30,000-foot perspective, packaging is someth... » read more

ATE Tailwind For 2018?
By Jeff Dorsch - 05 Feb, 2018 - Comments: 0

The automatic test equipment market enjoyed a record sales year during 2017, and there are indications that the good times will continue this year. Forecasters are predicting another robust year for sales of DRAMs and NAND flash memory devices, especially 3D NAND. That will drive demand for memory test equipment to keep up. Frost & Sullivan predicts semiconductor test equipment will h... » read more

NI Trend Watch 2018
By NI - 05 Feb, 2018 - Comments: 0

Technology has never progressed faster than it is today, so we must think critically about where we’re headed and how we’ll get there. The NI Trend Watch provides insight into some of the biggest trends and challenges engineers will face as we accelerate into our future faster than ever before. To read more, click here. » read more

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

Cheaper Packaging Options Ahead
By Ed Sperling - 05 Feb, 2018 - Comments: 0

Lower-cost packaging options and interconnects are either under development or just being commercialized, all of which could have a significant impact on the economics of advanced packaging. By far, the most cited reason why companies don't adopt advanced [getkc id="27" kc_name="packaging"] is cost. Currently, silicon [getkc id="204" kc_name="interposers"] add about $30 to the price of a med... » read more

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