Achieving ISO 26262 Software Tool Confidence For Improved Automotive Functional Safety
By Synopsys - 24 Jan, 2018 - Comments: 0

Achieving ISO 26262 Software Tool Confidence for Improved Automotive Functional Safety The rapid adoption of advanced electronic systems in automobiles has prompted the automotive industry to develop the ISO 26262 functional safety standard to address the potential risks associated with failures in these systems. ISO 26262 is derived from the more general IEC 61508 standard and defines requirem... » read more

Heatsinks Here, There, Everywhere!
By Mentor, a Siemens Business - 24 Jan, 2018 - Comments: 0

Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. A heatsink makes heat spread out, so that it passes to the air over a much larger surface area than it would otherwise. Air then carries the heat away, cooling the electronics that generated it. So, why not place a heatsink on top of any thermally critical component? To read more, click here. » read more

Pattern-Based Analytics To Estimate And Track Yield Risk Of Designs Down To 7nm
By Cadence - 24 Jan, 2018 - Comments: 0

Topological pattern-based methods for analyzing IC physical design complexity and scoring resulting patterns to identify risky patterns have emerged as powerful tools for identifying important trends and comparing different designs. In this paper, previous work is extended to include analysis of layouts designed for the 7nm technology generation. A comparison of pattern complexity trends with r... » read more

Memory Market: Will History Repeat Itself?
By Joanne Itow - 24 Jan, 2018 - Comments: 0

While updating the Semico Fab Database and capital investment projections for 2018, China's investment in memory capacity sparked a lot of discussion at our weekly Semico roundtable. Will China's investment in memory production capacity be successful, or will it just ruin the party for all memory players? Here are some of the highlights of our discussion. Additional data and insights are includ... » read more

Blog Review: Jan. 24
By Jesse Allen - 24 Jan, 2018 - Comments: 0

Mentor's Rich Edelman shares some tips for debugging complex UVM testbenches containing multiple agents, multiple checkers, and new HDL. Synopsys' Prasad Subudhi K. S. explains the PCIe PIPE 4.4.1 specification and the major improvements since 4.3, including better optimization in data flow and ultra-low power operations. Cadence's Paul McLellan steps back to before the Meltdown and Spect... » read more

eSilicon Builds ASIC Business On Leading-Edge Chip Design
By eSilicon - 24 Jan, 2018 - Comments: 0

This paper explores how advanced application specific integrated circuits (ASIC) chip design and manufacturing for leading-edge applications such as networking and artificial intelligence can be successfully outsourced. The company we profile is eSilicon, which has capabilities in 2.5D packaging, high-bandwidth memories (HBM), and silicon IP for fast memories and SerDes designs. The company ha... » read more

Metal Markets In Flux
By Mark LaPedus - 24 Jan, 2018 - Comments: 0

Markets for critical metals are becoming turbulent, creating shortages and widespread supply chain concerns. Critical metals are the raw elements and materials used in the production of aerospace/defense systems, automobiles, batteries, computers and electronic products. Many critical metals also are scarce, and there is high risk associated with their supply. In a recent report, the Europea... » read more

Manufacturing Bits: Jan. 23
By Mark LaPedus - 23 Jan, 2018 - Comments: 1

Looking inside memristors E-beam inspection is gaining steam. Using this type of technology, the National Institute of Standards and Technology (NIST) has been able to see the inner workings of the memristor. The memristor is a type of ReRAM, which works by changing the resistance of materials. In a memristor, an electric current is applied to a material, changing the resistance of that mat... » read more

System Bits: Jan. 23
By Ann Mutschler - 23 Jan, 2018 - Comments: 0

Artificial synapse for “brain-on-a-chip” portable AI devices In the emerging field of neuromorphic computing, researchers are attempting to design computer chips that work like the human brain, which, instead of carrying out computations based on binary, on/off signaling like digital chips do today, the elements of a brain-on-a-chip would work in an analog fashion, exchanging a gradient of... » read more

Power/Performance Bits: Jan. 23
By Jesse Allen - 23 Jan, 2018 - Comments: 0

Atomristors for thin memory Engineers at The University of Texas at Austin and Peking University developed a thin memory storage device with dense memory capacity. Dubbed "atomristors," the device enables 3-D integration of nanoscale memory with nanoscale transistors on the same chip. "For a long time, the consensus was that it wasn't possible to make memory devices from materials that were... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2025 SMG   |  Terms of Service  |  Privacy Policy