No-Compromise Packetized Test Improves DFT Efforts
By Peter Orlando - 14 Jan, 2025 - Comments: 0

Design for Test (DFT) managers often must make difficult and sometimes costly trade-offs between test implementation effort and manufacturing test cost. The traditional method for evaluating these trade-offs has been to use hierarchical DFT methods in a divide-and-conquer approach. In hierarchical DFT efforts, all implementation, including pattern generation and verification, is done at the cor... » read more

DFT At The Leading Edge
By Gregory Haley - 14 Jan, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the rapidly changing landscape of design for testability (DFT), focusing on the impact of advancements in fault models, high-speed interfaces, and lifecycle data analytics, with Jeorge Hurtarte, senior director of product marketing in the Semiconductor Test Group at Teradyne; Sri Ganta, director of test products at Synopsys; D... » read more

Research Bits: Jan. 13
By Jesse Allen - 13 Jan, 2025 - Comments: 0

High-temp electrochemical memory Researchers from the University of Michigan and Sandia National Laboratory propose a nonvolatile electrochemical memory that can store and rewrite information at temperatures over 1100°F (600°C), enabling it to continue working in environments as extreme as the surface of Venus. Instead of transporting electrons, the memory moves oxygen ions between layere... » read more

Startup Challenges In A Changing EDA World
By Brian Bailey - 13 Jan, 2025 - Comments: 0

The Electronic Design Automation (EDA) industry is a mature industry, but it's also one that is constantly changing. Each process node and packaging technology advancement places new demands and constraints on existing tools. In addition, changing design problems and paradigms transform how design teams operate, and the goals they target. For a relatively small industry, EDA requires a dispr... » read more

Chip Industry Week In Review
By The SE Staff - 10 Jan, 2025 - Comments: 0

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. In U.S. government news: The U.S. Department of Commerce finalized up to $325 million in CHIPS Act funding for Hemlock Semiconductor, which will support construction of a new semiconductor-grade polysilicon manufac... » read more

Cryptography Does Not Equal Security
By Bart Stevens - 09 Jan, 2025 - Comments: 0

At Rambus, we often receive RFIs, RFPs and RFQs for security silicon IP cores to be used in our customer’s next semiconductor product. Such requests often contain a long shopping list of required cryptographic algorithms, their modes of operation, their key lengths or strengths and performance and sizing requirements. Depending on the target segment, additional requirements such as robustness... » read more

Edge And IoT Security Turning A Corner
By Ed Sperling - 09 Jan, 2025 - Comments: 0

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and communication across different market segments that in the past had little or no interaction. Until recently, many vendors in cost-sensitive markets offered the bare minimum of security. To make matt... » read more

How Software-Defined Vehicles Change Auto Chip Design
By Adam Kovac - 09 Jan, 2025 - Comments: 0

The shift to software-defined vehicles is changing nearly every aspect of automotive design, from what hardware is added into vehicles, when it gets added, and what gets left behind. Moving key features to software rather than hardware allows carmakers to bring new features to market faster, at a lower cost, and to modify those features more quickly. It is also expected to drive up the value... » read more

ISO 26262’s Importance Widens Beyond Automotive
By Adam Kovac - 09 Jan, 2025 - Comments: 0

The ISO 26262 standard, which has become a mainstay since the trend toward vehicle electrification really took root a decade ago, is starting to gain traction in markets outside of automotive chip and system design. At the center of this expansion is a focus on safety under a variety of conditions — extreme temperatures, unexpected vibration, or a collision that is unavoidable. This includ... » read more

Averting Hacks Of PCIe Transport Using CMA/SPDM
By Siemens EDA - 09 Jan, 2025 - Comments: 0

This paper describes the component measurement and authentication (CMA) and security protocol and data model (SPDM) flow used to establish the secure channels required for the transmission of encrypted packets. The various approaches, namely the symmetric and asymmetric flows, will be discussed in establishing a secure connection with the implementation of CMA/SPDM packets through data objects.... » read more

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