Chip Industry Heads Toward $1T
By Ed Sperling - 27 Apr, 2022 - Comments: 0

The chip industry is on track to hit $1 trillion sometime over the next decade, and while the exact timing depends on a variety of factors, the trend line appears to be stable. The digitization of data, the digitalization of technology, and the expansion into new and existing markets, collectively are expected to drive chip industry growth for years to come. Exactly when the IC world will to... » read more

Advances In EM Analysis And Design Flows For RF System Development
By Cadence - 27 Apr, 2022 - Comments: 0

With the move toward higher frequencies and component densities, RF/mixed signal PCB systems and heterogeneous system-in-package (SiP) technologies are increasingly susceptible to delayed product development turnaround times that threaten delivery schedules. These delays often occur late in development during integration when components that met the design specifications fail to achieve the req... » read more

Streamlining Vehicular Electrical System Design And Verification
By Synopsys - 27 Apr, 2022 - Comments: 0

Automobiles and other road vehicles such as trucks and buses have always been one of the most demanding applications for mechanical and electrical design. Systems must operate properly over a wide range of environmental conditions, facing extremes of temperature, humidity, sunlight, dirt, vibration and more. User expectations of reliability and availability mandate safety-critical design practi... » read more

Blog Review: April 27
By Jesse Allen - 27 Apr, 2022 - Comments: 0

Siemens' Joseph Dailey and Jake Wiltgen dispel misunderstandings around safety qualification of software tools and point to some of the safety issues that could lead to schedule delays and additional costs. Synopsys' Mark Kahan explains the testing that went into creating parts of the James Webb Space Telescope and key questions that were asked to ensure the mission could be successful even ... » read more

Current Knowledge & Future Development In 2D Magnetic Materials Research
By Technical Paper Link - 26 Apr, 2022 - Comments: 0

Abstract: "Magnetism in two-dimensional (2D) van der Waals (vdW) materials has recently emerged as one of the most promising areas in condensed matter research, with many exciting emerging properties and significant potential for applications ranging from topological magnonics to low-power spintronics, quantum computing, and optical communications. In the brief time after their discovery, 2D... » read more

Pyrolyzed Cellulose Nanofiber Paper (CNP) Semiconductor with a 3D Network Structure
By Technical Paper Link - 26 Apr, 2022 - Comments: 0

Abstract Semiconducting nanomaterials with 3D network structures exhibit various fascinating properties such as electrical conduction, high permeability, and large surface areas, which are beneficial for adsorption, separation, and sensing applications. However, research on these materials is substantially restricted by the limited trans-scalability of their structural design and tunability of... » read more

Technical Paper Round-up: April 26
By Linda Christensen - 26 Apr, 2022 - Comments: 0

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /]   Semiconductor Engineering is in the process of building this library of research papers.  Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

Research Bits: April 26
By Jesse Allen - 26 Apr, 2022 - Comments: 0

Photonic quantum computers Researchers from Stanford University propose a simpler design method for photonic quantum computers. The proposed design uses a laser to manipulate a single atom that, in turn, can modify the state of the photons via a phenomenon called “quantum teleportation.” The atom can be reset and reused for many quantum gates, eliminating the need to build multiple distinc... » read more

Artificial intelligence deep learning for 3D IC reliability prediction
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

Efficacy of Transistor Interleaving in DICE Flip-Flops at a 22 nm FD SOI Technology Node
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research paper from University of Saskatchewan, with funding by NSERC and the Cisco University Research Program. Abstract "Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single event upsets than comparable bulk technologies, but upsets are still likely to occur at nano-scale feature sizes, and additional hardening techniques should be explor... » read more

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