Enabling New Functionality In Medtech And Biotech Devices

By Dick Otte - 18 May, 2023 - Comments: 0

Medtech and biotech devices are uniquely suited to benefit from emerging electronic capabilities – specifically, the kind of electronics design, packaging and assembly offerings that are Promex’s specialty. With that said, these markets present a variety of manufacturing challenges and demands that require heterogeneous integration (HI) to address. This two-part blog post provides a high... » read more

MEMS & Sensors Market Forecast: Impact Of Semiconductor Industry Slowdown

By Timothy Brosnihan - 18 May, 2023 - Comments: 0

Of all technologies, MEMS and sensors stand out for their far-reaching promise to improve lives across segments such as Internet of Things (IoT), wearables, smart home, digital health, precision agriculture, autonomous vehicles, robotics, and environmental monitoring. Little wonder, then, that the growth of the MEMS and sensor design and manufacturing industry is among the hottest topics at ... » read more

Cross-Shaped Reconfigurable Transistor (CS-RFET) With Flexible Signal Routing

By Technical Paper Link - 17 May, 2023 - Comments: 0

A new technical paper titled "Cross-Shape Reconfigurable Field Effect Transistor for Flexible Signal Routing" was published by researchers at NaMLab gGmbH, École Centrale de Lyon, and TU Dresden. "A detailed comprehensive study of the cross-shape reconfigurable field effect transistor electrical characteristics are presented. The fabricated device demonstrates nearly equal transistor charac... » read more

Breaking The 1M RAID5 Write IOPS Barrier

By Samsung - 17 May, 2023 - Comments: 0

In today’s data-centric age, enormous amounts of data are generated, stored and processed at an unprecedented rate. Businesses are utilizing this data to make better decisions, drive greater efficiencies, develop more desirable products, improve profitability and ultimately increase user satisfaction. To continue deriving a high degree of value from a rapidly-expanding data flow, today’s en... » read more

Blog Review: May 17

By Jesse Allen - 17 May, 2023 - Comments: 0

Synopsys' Dana Neustadter examines the key industries driving Ethernet security, challenges to securing Ethernet networks, and the MACsec protocol that guards against network data breaches by encrypting data traffic between Ethernet-connected devices. Siemens' Stephen Chavez points to the improvements gained from design reuse in PCB design but warns that inefficient processes for managing an... » read more

Machine Vision Plus AI/ML Adds Vast New Opportunities

By John Koon - 17 May, 2023 - Comments: 0

Traditional technology companies and startups are racing to combine machine vision with AI/ML, enabling it to "see" far more than just pixel data from sensors, and opening up new opportunities across a wide swath of applications. In recent years, startups have been able to raise billions of dollars as new MV ideas come to light in markets ranging from transportation and manufacturing to heal... » read more

Photonic Debond: Scalability And Advancements

By Brewer Science - 17 May, 2023 - Comments: 0

Advanced packaging technology has continuously evolved over the past 10-20 years to become a major driving force in improving integrated circuit (IC) performance. This improvement in IC performance is assisted by the ability to place specialized components near each other for shorter interconnects in the IC packages. Temporary bond and debond (TB/DB) is an enabling technique for this work. TB/D... » read more

Edge HW-SW Co-Design Platform Integrating RISC-V And HW Accelerators

By Technical Paper Link - 16 May, 2023 - Comments: 0

A new technical paper titled "EigenEdge: Real-Time Software Execution at the Edge with RISC-V and Hardware Accelerators" was published by researchers at Columbia University. "We introduce a hardware/software co-design approach that combines software applications designed with Eigen, a powerful open-source C++ library that abstracts linear-algebra workloads, and real-time execution on heterog... » read more

Challenges In Packaging 5G And 6G

By Ed Sperling - 16 May, 2023 - Comments: 0

Millimeter wave frequencies are essential for transferring more data more quickly, but they also require different packaging technology to minimize loss and drift. That opens up a number of tradeoffs around antenna in package, antenna on package, flexible circuits, and different substrates. Curtis Zwenger, vice president of R&D at Amkor Technology, talks about a host of new challenges rangi... » read more

Research Bits: May 16

By Jesse Allen - 16 May, 2023 - Comments: 0

Germanium-tin transistor Scientists at Forschungszentrum Jülich, CEA-Leti, University of Leeds, Leibniz Institute for High Performance Microelectronics, and RWTH Aachen University fabricated a new type of transistor from a germanium-tin alloy. Charge carriers can move faster in the material than in silicon or germanium, which enables lower voltages in operation. “The germanium–tin syst... » read more

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