Deep Learning Delivers Fast, Accurate Solutions For Object Detection In The Automated Optical Inspection Of Electronic Assemblies
By Charlie Zhu - 07 Dec, 2021 - Comments: 0

When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. However, some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. For example, shown an image containing a cat, a dog, and a duck, a human can insta... » read more

Streaming Scan Network: An Efficient Packetized Data Network For Testing Of Complex SoCs
By Siemens EDA - 07 Dec, 2021 - Comments: 0

Originally presented at the 2020 International Test Conference by Siemens and Intel authors, this paper describes the Tessent Streaming Scan Network technology and demonstrates how this packetized data network optimizes test time and implementation productivity for today’s complex SoCs. The author-submitted version of the IEEE paper is reprinted here with permission. Authors: Jean-Françoi... » read more

Optimizing System Performance At Runtime
By Tomer Morad - 07 Dec, 2021 - Comments: 0

Silicon lifecycle management (SLM) is one of the hottest emerging topics in the semiconductor industry. Chip and system developers face relentless demands for ever greater performance, reliability, functional safety, and security along with lower power consumption and silicon cost. Key applications driving these demands include data centers, autonomous vehicles, complex consumer devices such as... » read more

HSIO Loopback Turns Challenges Into Opportunities For Test At 112 Gbps
By Dave Armstrong - 07 Dec, 2021 - Comments: 0

By Dave Armstrong and Don Thompson For both PCIe and Ethernet (IEEE 802.3,) signals are getting mighty small. With PCIe 5 reaching 32 Gbps (NRZ at 32 GBaud) and 802.3 reaching 112 Gbps (PAM4 at 56 GBaud), typical eye-mask limits are shrinking. Consequently, test requirements for high-speed I/O (HSIO) test are becoming daunting. HSIO test involves measurement of Tx eye height and width, co... » read more

Case Study — Deep Learning For Corner Fill Inspection And Metrology On Integrated Circuits
By CyberOptics - 07 Dec, 2021 - Comments: 0

CyberOptics utilized deep learning to accurately inspect the corner fill on integrated circuits (ICs) produced by a large memory supplier. Traditional methods of inspection showed limitations in their ability to entirely detect the presence and absence of fill, indicating that a more advanced approach was necessary. CyberOptics drew on its large pool of algorithm and neural network expertise to... » read more

Success Stories For Packetized Scan Data
By Geir Eide - 07 Dec, 2021 - Comments: 0

Some new design-for-test (DFT) technologies are difficult, expensive, or risky to implement but offer significant benefits. Other technologies are easy to implement but offer minor improvements. The calculation of whether (or when) to adopt new technology includes consideration of the pressures of DFT today—design complexity, the lack of flexibility in hardwiring scan channels, the proliferat... » read more

Big Payback For Combining Different Types Of Fab Data
By Anne Meixner - 07 Dec, 2021 - Comments: 1

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging
By Onto Innovation - 07 Dec, 2021 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market that includes smartphones, data centers, servers, HPC, AI and IoT applications. Next-generation packaging technologies require tighter overlay to accommodate a larger package size with finer pitch chip interconnects on large format flexible panels. Heterogeneous integration enables next-generation device performance ... » read more

Engineers’ Experiences Around The World
By Ben Tsai - 07 Dec, 2021 - Comments: 0

As CTO, I see my role partially as strengthening the engineering community through program reviews, engineering education programs, conferences, seminars, and the product life cycle process at KLA. I also think it is critically important to spark engineering enthusiasm – helping engineers rediscover the excitement and curiosity that helps drive innovation. When inspired to create, engineers c... » read more

Manufacturing Bits: Dec. 6
By Mark LaPedus - 06 Dec, 2021 - Comments: 0

China’s rare earth power play Rare earth elements (REEs) are back in the news. China, the world’s largest supplier of rare earths, plans to combine three domestic vendors to create a large state-owned company with a nearly 70% share of the REE market, according to reports from Nikkei and others. In 2020, China in total accounted for 85% of global production of refined REEs, accordi... » read more

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