Simulation-Based Fault Analysis for Resilient System-On-Chip Design


Abstract: "Enhancing the reliability of the system is important for recent system-on-chip (SoC) designs. This importance has led to studies on fault diagnosis and tolerance. Fault-injection (FI) techniques are widely used to measure the fault-tolerance capabilities of resilient systems. FI techniques suffer from limitations in relation to environmental conditions and system features. Moreover,... » read more

Netlist Decompilation Workflow for Recovered Design Verification, Validation, and Assurance


Abstract: "Over the last few decades, the cost and difficulty of producing integrated circuits at ever shrinking node sizes has vastly increased, resulting in the manufacturing sector moving overseas. Using offshore foundries for chip fabrication, however, introduces new vulnerabilities into the design flow since there is little to no observability into the manufacturing process. At the same ... » read more

A New Multi-Stimuli-Based Simulation Method for ESD Design Verification


Abstract: "This paper analyzes TCAD ESD simulation for both HBM zapping using real-world HBM ESD waveforms as stimuli and TLP testing using square wave TLP pulse trains as stimuli. It concludes that TCAD ESD simulation using either HBM waveforms or TLP pulse trains, alone, is insufficient. We introduce a new mixed-mode simulation flow using combined HBM and TLP stimuli to achieve ESD design pr... » read more

Application and Verification of Effective Heat Spreading Angles on a Multi-Layer Thermal Design


Abstract: "When designing converters, the average junction temperature of the semiconductor is a frequently required estimate. Its analytical calculation requires the total thermal resistance of the cooling arrangement. Unfortunately, due to the complexity of the heat dissipation processes, an estimate of the thermal resistance is usually associated with low accuracy. To significantly improve ... » read more

Week In Review: Manufacturing, Test


Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

Week In Review: Design, Low Power


Infineon reported fourth quarter 2021 financial results with revenue of €3.0 billion (~$3.4 billion), up 21% compared to the same quarter last year. For the full year, revenue was €11.1 billion (~$12.7 billion), an increase of 29% from the previous year. "In light of the continued high demand for semiconductors needed for the energy-efficient, connected world, we expect the 2022 fiscal year... » read more

High-Performance CoolSiC MOSFET Technology With Silicon-Like Reliability


The performance potential of SiC is indisputable. The key challenge to be mastered is to determine which design approach achieves the biggest success in applications. Click here to read more. » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive The U.S. Congress passed an infrastructure bill that includes mandates for the U.S. automobiles to install technology in new vehicles that will stop impaired drivers from driving a vehicle. Sec. 24220, the advanced impaired driving technology section of the bill says the Secretary of Transportation is responsible for coming up with standards after which the auto industry has at the ... » read more

Quantum well interband semiconductor lasers highly tolerant to dislocations


Abstract "III-V semiconductor lasers integrated on Si-based photonic platforms are eagerly awaited by the industry for mass-scale applications, from interconnect to on-chip sensing. The current understanding is that only quantum dot lasers can reasonably operate at the high dislocation densities generated by the III-V-on-Si heteroepitaxy, which induces high non-radiative carrier recombination ... » read more

Development Of Distributed Intelligent Systems With The Robot Operating System


Networked robotic systems are increasingly prevalent. In addition to industrial robotics now firmly ensconced in manufacturing, applications are also being developed in the areas of logistics, medical technology, and even unmanned aerial vehicles (UAV) and unmanned underwater vehicles (UUV). In general, robotic systems are still centrally controlled by a PLC based on statically planned tasks... » read more

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