PCB Design From Start To Finish: E-Book


This ebook by John Burkhert is a step-by-step guide on printed circuit board design with information suitable for beginners to graduate-level users. This series is for anyone who wants to design their own printed circuit boards or perform designs for others. While an electronics degree is not required, beginners would do well to consider basic electronic theory as a prerequisite. Each ... » read more

Research Bits: Nov. 1


Atomic-level rare earth manipulation Scientists from Ohio University, Argonne National Laboratory, and the University of Illinois at Chicago have rotated a single, charged rare earth molecule on a metal surface without changing the charge. The team used scanning tunneling microscopy (STM) system to rotate a positively charged Europium base molecule with negatively charged counterions as a p... » read more

Chip Industry’s Technical Paper Roundup: Nov. 1


New technical papers added to Semiconductor Engineering’s library this week. [table id=61 /] » read more

L-FinFET Neuron For A Highly Scalable Capacitive Neural Network (KAIST)


A new technical paper titled "An Artificial Neuron with a Leaky Fin-Shaped Field-Effect Transistor for a Highly Scalable Capacitive Neural Network" was published by researchers at KAIST (Korea Advanced Institute of Science and Technology). “In commercialized flash memory, tunnelling oxide prevents the trapped charges from escaping for better memory ability. In our proposed FinFET neuron, t... » read more

How Digital Twins Are Unlocking The Next Era Of Aerospace And Government Applications


By Ian Land, Jason Niatas, and Marc Serughetti Amidst changing economic waters and stringent manufacturing cycles, the aerospace, defense, and government landscape has seen an impressive technological evolution in the last few years. Innovations such as automating mission-critical systems and deploying advanced electronics in deep space exploration are expanding opportunities for government ... » read more

Chip Design Shifts As Fundamental Laws Run Out Of Steam


Dennard scaling is gone, Amdahl's Law is reaching its limit, and Moore's Law is becoming difficult and expensive to follow, particularly as power and performance benefits diminish. And while none of that has reduced opportunities for much faster, lower-power chips, it has significantly shifted the dynamics for their design and manufacturing. Rather than just different process nodes and half ... » read more

Full Wafer Integration of Aggressively Scaled 2D-Based Logic Circuits (Imec)


A technical paper titled "Challenges of Wafer-Scale Integration of 2D Semiconductors for High-Performance Transistor Circuits" was published by researchers at Imec. "The introduction of highly scaled 2D-based circuits for high-performance logic applications in production is projected to be implemented after the Si-sheet-based CFET devices. Here, a view on the requirements needed for full waf... » read more

Site-Specific Compositional Info from Periodic Nanostructures Obtained Using Rutherford Backscattering Spectrometry


A new technical paper titled "Quantification of area-selective deposition on nanometer-scale patterns using Rutherford backscattering spectrometry" was published by researchers at IMEC and KU Leuven. "We present a site-specific elemental analysis of nano-scale patterns whereby the data acquisition is based on Rutherford backscattering spectrometry (RBS). The analysis builds on probing a larg... » read more

Side-Channel Secure Translation Lookaside Buffer Architecture


A new technical paper titled "Risky Translations: Securing TLBs against Timing Side Channels" was posted by researchers at Ruhr University Bochum (Germany) and Cyber-Physical Systems of the German Research Center for Artificial Intelligence (DFKI). Abstract: "Microarchitectural side-channel vulnerabilities in modern processors are known to be a powerful attack vector that can be utilized to... » read more

Chip Industry Earnings: A Mixed Bag


Editor's Note: Updated the week of Oct. 31 and Nov. 7 for additional earnings releases. Although most companies reported revenue growth, this latest round of chip industry earnings releases reflected a few major themes: Lower future quarter guidance to varying degrees, due to the recent U.S. export restrictions related to China; Negative impact of the inflationary environment on corn... » read more

← Older posts Newer posts →