HW Security: Inner Product Masking With Fault Detection Via ISE (KU Leuven, NUS, Rambus)
By Technical Paper Link - 09 Dec, 2025 - Comments: 0

A new technical paper titled "Extending and Accelerating Inner Product Masking with Fault Detection via Instruction Set Extension" was published by researchers at KU Leuven, National University of Singapore, and Rambus. Abstract  "Inner product masking is a well-studied masking countermeasure against side-channel attacks. IPM-FD further extends the IPM scheme with fault detection capabil... » read more

Tracing The Equipment Connectivity Journey
By Bob Reback - 09 Dec, 2025 - Comments: 0

The semiconductor industry has undergone a dramatic transformation from the early days of manual integration to today's AI-driven collaboration with equipment connectivity at the heart of this evolution. Understanding these trends is crucial for any organization looking to leverage data for improved efficiency, reliability, and competitive advantage. This blog explores milestones and emergin... » read more

Smaller Geometries, Bigger Demands: The Role Of OCD In GAA Logic And Vertical Gate DRAM Process Control
By Jiangtao Hu - 09 Dec, 2025 - Comments: 0

AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development. Chief among these innovations: gate-all-around (GAA) logic transistor and vertical gate (VG) DRAM, two device architectures that promise higher performance, improved power efficiency, and greater scalabil... » read more

Adaptive Test Gaining Ground For HPC And AI Chips
By Gregory Haley - 09 Dec, 2025 - Comments: 0

Adaptive test is starting to gain traction for high-performance computing and AI chips as test programs that rely on static limits and fixed test sequences reach their practical limits. The growing complexity of multi-die assemblies and power delivery, along with increased stresses, are forcing a shift toward real-time, data-driven optimization at the test cell. “It’s the same old pro... » read more

Invisible Interfaces: The Hidden Challenge Behind Every Great Image Sensor
By Alexander Metzdorf - 09 Dec, 2025 - Comments: 0

When you snap a photo on your phone or rely on a car’s camera for lane detection, you’re trusting an unseen network of technologies to deliver or interpret image data flawlessly. But behind the scenes, the interface between the image sensor and its processor is doing the heavy lifting, moving megabtyes of data without error or delay. While much of the industry conversation focuses on adv... » read more

Resilient And Optimized GenAI Systems
By Ziv Paz - 09 Dec, 2025 - Comments: 1

AI and data center systems are being pushed to their limits, with soaring complexity, nonstop inference workloads, and rising energy demands. Addressing these pressures requires more than incremental improvements, it calls for collaboration across the ecosystem. That’s why proteanTecs has joined forces with Arm, bringing our real-time monitoring technology into Arm’s Neoverse Compute Subsys... » read more

Boosting Production Performance: Ensuring Only Known-Good Sockets Enter Your Line
By Jesse Ko - 09 Dec, 2025 - Comments: 0

Efficient, stable, and high-yield semiconductor production depends on one often-overlooked factor: the health of your test sockets. In many factories, socket maintenance and inspection practices haven't kept pace with the demands of today’s high-density, high-speed packages. The result? Hidden marginal pins, unexpected downtime, multisite yield variation, and inflated manufacturing costs. ... » read more

Metrology Digs Deep To Produce Next-Generation 3D NAND
By Laura Peters - 09 Dec, 2025 - Comments: 1

Each generation of 3D NAND packs about 30% more bits than the previous version, with current devices storing up to 2 terabits of data in a die the size of a fingernail. With new product introductions shrinking from 18 months to every 12 months, chipmakers are constantly innovating to enable this prodigious scaling pace. 3D NAND technology is a core ingredient in mobile phones, solid-state dr... » read more

Overview Of Radiation Dose During X-ray Inspection Of Electronics
By Nordson Test And Inspection - 09 Dec, 2025 - Comments: 0

X-ray imaging of semiconductor and electronic devices is an invaluable tool; enabling non-invasive sub-surface inspection, identification of defects and measurement of critical dimensions. Figure 1 shows a schematic and description of a typical X-ray inspection system for electronics and semiconductor devices. Unfortunately, semiconductor devices are sensitive to sustained radiation dose, which... » read more

Beyond The Core: Tackling System-Wide Debugging For Complex SoCs
By Francisca Tan - 09 Dec, 2025 - Comments: 0

The world of System-on-Chips (SoCs) is evolving – with the advancement of generative AI, the increasing demand for high-performance compute, and the innovative shift towards multi-chiplet architectures, system complexity is advancing at an increased pace. And with complexity comes an even greater challenge: debugging complexity. Silent data corruption, elusive timing-sensitive bugs, and i... » read more

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