category: Power Source

category: IoT, Security & Automotive

Top 5 Reasons For Power Delivery Failure
By Matt Elmore - 12 May, 2011 - Comments: 0

By Matt Elmore Technology scaling has brought with it a myriad of causes for power delivery network (PDN) failure. Even a few years ago, it was simply enough to run static and dynamic power analysis to expose any voltage drops caused by weak power routing. No one cared about modeling the package and PCB. To account for clock jitter, you could simply throw in a whole nanosecond of clock uncerta... » read more

Power Budgeting 101
By Aveek Sarkar - 14 Apr, 2011 - Comments: 0

By Aveek Sarkar With all the processing power that is being designed into smart and superphones now, I wonder what would happen if all four multi-GHz processors were to execute simultaneously? How long would that small battery last—and would anyone be able to hold it in their bare hands?   [caption id="attachment_6305" align="alignnone" width="342"] Phone surface temperature as a ... » read more

Quicker Turnaround
By Aveek Sarkar - 17 Mar, 2011 - Comments: 0

By Aveek Sarkar Statistics indicate the increase in sales for mobile handsets in the emerging economies will be from the sale of smart phones. According to a Nielsen report, Brazilian sales of smart phones were up 128% in 2010, compared to 2009. These emerging economies have traditionally been served by standard cell phones that provided voice and texting needs (Fig. 1), but the consumers i... » read more

Chip-Package-System Co-Design
By Matt Elmore - 10 Feb, 2011 - Comments: 0

By Matt Elmore This year’s DesignCon 2011 featured a multitude of advanced topics pertaining to IC design. One topic that came up repeatedly was chip-package-system (CPS) co-design. In each area of application, from mobile to automotive, IC designers have prioritized the need to analyze the chip, package, and PCB as complete system, rather than independent projects. The old days of margins, ... » read more

What is CPS?
By Matt Elmore - 12 Jan, 2011 - Comments: 0

CPS stands for Chip-Package-System. It represents a paradigm shift from the old partitioned approach of IC design into a cohesive methodology that considers the ecology of the system as comprised of the chip, package and board. Today’s design requirements are calling for a revisit to the way we look at IC design and validation. Companies no longer can afford to view design with a silo-base... » read more

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