category: Blogs – MD

category: IoT, Security & Automotive

Mask Issues Ahead
By eBeam Initiative - 17 Apr, 2014 - Comments: 0

It's not just the lithography that's getting complicated. Check out this video by Dai Nippon Printing's Naoya Hayashi. [youtube vid=a6WmvhTdEv4] » read more

Living On The Edge
By Ed Sperling - 17 Apr, 2014 - Comments: 0

Looking around the globe at the big foundries these days, many of them are in danger zones—geopolitical, seismological, or areas that have been the incubators for public health disasters in recent years. This is one of the risks of a global supply chain, and it’s one that should cause ulcers for any supply chain management executive. South Korea’s Samsung is within a short missile laun... » read more

IoT Roadblocks: Speed Bumps Or Major Road Closure?
By Joanne Itow - 17 Apr, 2014 - Comments: 0

The Internet of Things promises to be a big volume market and continues to grab headlines as companies race forward to prepare for its highly anticipated exponential growth. Huge market size numbers are being tossed around in every article and presentation. But when will the IoT really make an impact and what will it look like? Are we setting ourselves up for a false start? The technology fo... » read more

Searching For Rare Earths
By Mark LaPedus - 17 Apr, 2014 - Comments: 2

The semiconductor industry is pre-occupied with several and expensive technologies at once. One the device side, the industry is looking at new chip architectures, such as 3D NAND, finFETs and stacked die. On the manufacturing front, there is 450mm technology, next-generation lithography (NGL) and new materials. And that’s just the tip of the iceberg. Another technology that deserve... » read more

Getting A Clearer Picture
By Geir Eide - 17 Apr, 2014 - Comments: 1

Scan test diagnosis is an established software-based methodology for localizing defects causing failures in digital semiconductor devices. Using structural test patterns (such as ATPG) and the design description, diagnosis turns failing test cycles into valuable data. Exactly how valuable this data is depends on the quality of the diagnosis results. A result that points to a small group of nets... » read more

EU Due Diligence For Conflict Minerals Focuses Upstream, For Now
By SEMI - 17 Apr, 2014 - Comments: 0

By Rania Georgoutsakou EU proposed legislation on responsible sourcing of ‘conflict minerals’, published on 5 March 2014, will create a voluntary scheme focusing on upstream suppliers that should help downstream users get the information they need to comply with the U.S. Dodd Frank Act. The EU proposals largely address concerns raised by SEMI and other industry associations, but things cou... » read more

Litho Is Out Of Sync
By Ed Sperling - 20 Mar, 2014 - Comments: 0

EUV’s repeated missed deadlines, and the slow-motion response by the rest of the industry to fill the void with alternatives, is having ripple effects in every facet and corner of the semiconductor industry. It’s making design harder and more expensive, introducing potential errors into the DFM flow, and greatly increasing the amount of time it takes to process wafers. It’s also adding a ... » read more

Enabling Wearable Electronics In The Internet of Things (IoT) Era
By Bharat Ramakrishnan - 20 Mar, 2014 - Comments: 0

As part of its growth focus for Applied Materials, the Office of the CTO (Chief Technology Officer) aims to do the following: Identify, incubate and commercialize growth opportunities in new and adjacent markets Build a culture of open innovation at Applied Materials Address market inflections and high value problems through differentiated solutions Shape the future of our growth mark... » read more

450mm Standards Update
By SEMI - 20 Mar, 2014 - Comments: 0

By Kevin Nguyen SEMI has published more than 19 Standards for 450mm generation.  New standards are being created to facilitate supplier and user for material and equipment.  Revisions to published standards are needed as improvements are constantly identified. The Japan Assembly & Packaging Technical Committee (TC) Chapter has initiated document 5636 in effort to meet the demand... » read more

Under The Radar At SPIE
By Mark LaPedus - 20 Mar, 2014 - Comments: 2

At the SPIE Advanced Lithography symposium, the best and brightest minds in the lithography, metrology, resist and design-for-manufacturing (DFM) fields assemble for a week. The annual event is a good way to get a pulse on the current state of lithography. At this year’s SPIE, it was simple to get a reading. Extreme ultraviolet (EUV) lithography remains delayed. The other next-generation l... » read more

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