category: Blogs – MD

category: IoT, Security & Automotive

You Can’t Get There From Here
By David Abercrombie - 17 Jul, 2013 - Comments: 0

By David Abercrombie In my last article, I reviewed the aspects of cell design that are affected by double patterning (DP). This time, I’ll discuss how automatic routing is affected by DP. Let’s begin by looking at the interaction between decisions made at the cell design level and decisions made at the routing level. One key routing decision is whether or not you will allow cell-to-cel... » read more

Mobility Gets A Boost With Expanded Epi Applications
By Applied Materials Writers - 17 Jul, 2013 - Comments: 0

By Jeremy Zelenko Even as industry moves into the era of the high k metal gate (HKMG) and FinFET transistor, chipmakers continue to seek ways to improve device performance. One of the latest advances and the subject of an Applied Materials announcement made today is to extend epitaxial deposition from PMOS to NMOS transistors. Implementing an NMOS epitaxy (epi) process in addition to the estab... » read more

GloFo Says 28nm FD-SOI Die Cost Much Less Than 28nm Bulk HPP
By Various Writers - 17 Jul, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ According to Shigeru Shimauchi, Country Manager, GlobalFoundries Japan, for the same level of performance, the die cost for 28nm FD-SOI will be substantially less than for 28nm bulk HPP (“high performance-plus”). Specifically, to get a 30%  increase in performance over 28nm bulk LPS PolySiON, HPP increases die ... » read more

Let’s All Meet At The Via Bar!
By Jean-Marie Brunet - 30 Jun, 2013 - Comments: 0

By Jean-Marie Brunet At 28 nm and below, a variety of new design requirements are forcing us to adjust the traditional layout and verification process of digital designs. The use of vias, in particular, has been significantly impacted. New via types have been introduced, and the addition of double patterning, FinFETS, and other new design techniques has not only generated a considerable increa... » read more

OLED Displacing LCD, But Not Affecting Industry Leaders
By Michael Watts - 25 Jun, 2013 - Comments: 0

By Michael P.C. Watts One of the most common themes in high tech is how companies fail to deal with game-changing new products. Think about Kodak and digital cameras, Sony and the flash memory music player, Microsoft and the tablet, GE and Osram and the Light Emitting Diode (LED). The overwhelming conclusion seems to be that you have to be committed to making your own most valuable product red... » read more

The Stakes Are High
By Joanne Itow - 20 Jun, 2013 - Comments: 0

By Joanne Itow Whether you call it a transition or a transformation, evolutionary or revolutionary, the implementation of 450mm wafers is going to be disruptive. There are both technical and operational hurdles associated with semiconductor production on 450mm wafers. The ramp of 450mm is expected to change the semiconductor manufacturing landscape. And what about the changes that may occur ev... » read more

Overcoming Shallow Trench Isolation
By Kathryn Ta - 20 Jun, 2013 - Comments: 0

By Kathryn Ta To prevent electrical current leaking between adjacent transistors, state-of-the-art microchips feature shallow trench isolation (STI) to isolate transistors from each other. Key steps in the STI process involve etching a pattern of trenches in the silicon, depositing dielectric materials to fill the trenches, and removing the excess dielectric using technologies such as chemical... » read more

Marching Orders
By Ed Sperling - 20 Jun, 2013 - Comments: 0

Reports back from the front lines of Moore’s Law are rather consistent—14nm and 16nm finFETs are do-able, but they’re not easy to design, verify or manufacture. In fact, the only high-volume source of production-proven finFETs at this point is Intel, which is turning them out at 22nm. A number of issues are cropping up at the most advanced nodes, and while each is ultimately solvable, ... » read more

VLSI Kyoto – The SOI Papers
By Various Writers - 19 Jun, 2013 - Comments: 0

By Adele Hars There were some breakthrough FD-SOI and other excellent SOI-based papers that came out of the 2013 Symposia on VLSI Technology and Circuits in Kyoto (June 10-14, 2013). By way of explanation, VSLI comprises two symposia: one on Technology; one on Circuits. However, papers that are relevant to both were presented in “Jumbo Joint Focus” sessions.  The papers should all b... » read more

Deja Vu All Over Again
By Brian Fuller - 19 Jun, 2013 - Comments: 0

By Brian Fuller I’m sure you’ve had that experience, at least once in your life, where you’re walking down the street, you pass someone and think, “Where do I know that guy from? Looks soooo familiar….” Well, here in this spot, I’m that guy. You’re looking at that incredibly sincere mug shot nearby and thinking, “Where do I know that guy from? Didn’t he sell me a really ... » read more

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