category: Looking Past The Horizon

category: IoT, Security & Automotive

Ensuring The Health And Reliability Of Multi-Die Systems
By Yervant Zorian - 26 Oct, 2023 - Comments: 0

From generative AI tools that rapidly produce chatbot responses to high-performance computing (HPC) applications enabling financial forecasting and weather modeling, it’s clear we’re in a whole new realm of processing power demand. Given these compute-intensive workloads, monolithic SoCs are no longer capable to meet today’s processing needs. Engineering ingenuity, however, has answered t... » read more

Accelerating Analog Design Migration
By Yuval Shay - 28 Sep, 2023 - Comments: 0

Today’s electronic chips are commonly comprised of a mix of analog, RF, and digital components, with increasing functionalities, complexities, and numbers of transistors reaching the trillions. While the digital side of the house can take advantage of automated design implementation tools, the analog world has always been more about doing things manually and in a very “custom” way—which... » read more

High-Quality Silicon With Cloud-Based Verification
By Rob van Blommestein - 15 Sep, 2023 - Comments: 0

New materials, vertically stacked architectures, and angstrom-level process technologies—the complexity of today’s SoCs continues to grow to meet the needs of demanding applications such as AI, autonomous vehicles, and high-performance computing. This trend only places greater pressure on verification, already notorious for being a significant bottleneck in chip development. Design teams... » read more

New Technology Accelerates Multi-Die System Simulation
By Taruna Reddy - 27 Jul, 2023 - Comments: 0

AI-powered chatbots. Robotic manufacturing equipment. Self-driving cars. Bandwidth-intensive applications like these are flourishing—and driving the move from monolithic system-on-chips (SoCs) to multi-die systems. By integrating multiple dies, or chiplets, into a single package, designers can achieve scaling of system functionality at reduced risk and with faster time to market. Multi-die... » read more

Overcoming Regression Debug Challenges With Machine Learning
By Robert Ruiz - 22 Jun, 2023 - Comments: 0

Development of a modern semiconductor requires running many electronic design automation (EDA) tools many times over the course of the project. Every stage, from architectural exploration and design to final implementation and manufacturing preparation, has multiple methodology loops that must be repeated again and again. Even in such a complex development flow, functional simulation stands ... » read more

Design Challenges Of High-Speed Wireline Transmitters
By Samad Parekh - 27 Apr, 2023 - Comments: 0

By Samad Parekh and Noman Hai The need for higher bandwidth networking equipment as well as connectivity in the cloud and hyperscale data centers is driving the switch technology transition from 25T (terabytes) to 50T and soon to 100T. The industry has chosen Ethernet to drive the switch market, using 112G SerDes technology today and next generation architectures being designed to operate at... » read more

How AI Drives Faster Verification Coverage And Debug For First-Time-Right Silicon
By Taruna Reddy - 23 Mar, 2023 - Comments: 0

By Taruna Reddy and Robert Ruiz These days, the question is less about what AI can do and more about what it can’t do. From talk-of-the-town chatbots like ChatGPT to self-driving cars, AI is becoming pervasive in our everyday lives. Even industries where it was perhaps an unlikely fit, like chip design, are benefiting from greater intelligence. What if one of the most laborious, time-co... » read more

Beyond Human Reach: Meeting Design Targets Faster With AI-Driven Optimization
By James Chuang - 23 Feb, 2023 - Comments: 0

The implementation flow for semiconductor devices is all about optimizing for power, performance, area (PPA), or some combination of these attributes. The history of this flow in electronic design automation (EDA) tools is all about adding more automation, tightening iterative loops, and reducing the number of iterations. The goal is converging to the PPA targets faster while using fewer resour... » read more

Benefits Of A Silicon-Proven 800G Ethernet Solution For High-Performance Computing
By Madhumita Sanyal - 26 Jan, 2023 - Comments: 0

The evolution of high-speed Ethernet began in 2014 when Arista, Broadcom, Microsoft, Mellanox and Google formed the Ethernet Consortium, now called the “Ethernet Technology Consortium.” Since then, the technology has been adopted by more than 45 members. The push for 200G, then 400G, and now 800G Ethernet is driven by the insatiable need to process and transmit high-performance workloads in... » read more

Automated Late Stage Timing-Aware Dynamic Voltage Drop ECO
By Manoj Chacko - 09 Jan, 2023 - Comments: 0

One of the never-ending frustrations for electrical engineers is having to deal with counterproductive real-world effects that they wish would just go away. Examples include switch bounce, metastability, and contact resistance. For IC designers, dynamic voltage drop (DVD), also known as IR drop, is one of those unfortunate facts of the profession. There’s no way to avoid it; every trace and w... » read more

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