category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 13 Jan, 2023 - Comments: 0

Global semiconductor sales hit $45.5 billion during the month of November 2022, according to SIA’s January announcement. Year-over-year sales increased in November in the Americas (5.2%), Europe (4.5%), and Japan (1.2%), but decreased in Asia Pacific/rest of world (-13.9%) and China (-21.2%). Month-to-month sales were down across all regions. The United States, Mexico and Canada vowed to... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 06 Jan, 2023 - Comments: 0

TSMC is in advanced talks with key suppliers about setting up its first potential European plant in Dresden, Germany, according to Nikkei Asia. The company held a 3nm volume production and capacity expansion ceremony at its Fab 18. TSMC also is building 3nm capacity at its Arizona site, as well as opening a global R&D Center in the Hsinchu Science Park in the second quarter of 2023, to be ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 22 Dec, 2022 - Comments: 0

SEMI , SEMI Europe and European Commission representatives, in consultation with semiconductor industry stakeholders, proposed initiatives to overcome the skills shortage in Europe’s microelectronics industry: Create an industry image campaign to raise public awareness on how technology is shaping the future, and how workers can establish careers in the semiconductor industry. Remove ... » read more

Multi-Beam Mask Writers Are A Game Changer
By Jan Willis - 22 Dec, 2022 - Comments: 0

The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported strong purchasing predictions for multi-beam mask writers, enabling both EUV and curvilinear photomask growth. A panel of experts debated remaining barriers to curvilinear photomask adoption during an event co-located with the SPIE Photomask Technology Conference in late September. Industry luminaries representing 44 compan... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 16 Dec, 2022 - Comments: 0

The CHIPS Act sparked $200 billion in private investments for U.S. semiconductor production, including 40 new semiconductor ecosystem projects, according to SIA. China is working toward self-sufficiency, with plans to invest more than 1 trillion yuan ($143 billion) to support domestic semiconductor production, according to Reuters. Arm said that Britain and the U.S. would not approve license... » read more

Heterogeneous Assembly Datasheet
By Promex Industries - 16 Dec, 2022 - Comments: 0

Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a cost-effective way, ideally using a rapid process development cycle to minimize time to market. Combining technologies, as well as combining... » read more

How Far Will Copper Interconnects Scale?
By Laura Peters - 15 Dec, 2022 - Comments: 0

As leading chipmakers continue to scale finFETs — and soon nanosheet transistors — to ever-tighter pitches, the smallest metal lines eventually will become untenable using copper with its liner and barrier metals. What comes next, and when, is still to be determined. There are multiple options being explored, each with its own set of tradeoffs. Ever since IBM introduced the industry to c... » read more

Ferroelectrics: The Dream Of Negative Capacitance
By Katherine Derbyshire - 15 Dec, 2022 - Comments: 0

Ferroelectrics are getting a serious re-examination, as chipmakers look for new options to maintain drive current. Ferroelectric materials can provide non-volatile memory, serving an important functional gap somewhere between DRAM and flash memory. Indeed, ferroelectrics for memory and 2D channels for transistors were two highlights of the recent IEEE Electron Device Meeting. Ferroelectri... » read more

3D Sensing Package Solutions
By Chiung Lee - 15 Dec, 2022 - Comments: 0

By Chiung Lee, Weilung Lu, and Adrian Arcedera 3D sensing technology is rapidly being adopted in a variety of growing markets. End-product applications include smartphones, tablets, augmented/virtual reality products, robot vacuum cleaners, industry inspection machines, and automotive vehicles. As shown in figure 1, Yole Développement expects the 3D imaging and sensing market to expand from... » read more

The March Toward Chiplets
By Ed Sperling and Karen Heyman - 15 Dec, 2022 - Comments: 0

The days of monolithic chips developed at the most advanced process nodes are rapidly dwindling. Nearly everyone working at the leading edge of design is looking toward some type of advanced packaging using discrete heterogeneous components. The challenge now is how to shift the whole chip industry into this disaggregated model. It's going to take time, effort, as well as a substantial reali... » read more

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