Semiconductor Manufacturing Equipment And Measures To Protect The Earth’s Environment

By TEL - 17 Nov, 2021 - Comments: 0

Over the years, many countries on our planet have made significant efforts to develop their economies, achieving remarkable advancements in a wide variety of industries. However, the progress came with a great cost to the Earth’s environment. The destruction of nature has occurred frequently as a matter of course, to such an extent that in some regions it would hardly be possible to restore n... » read more

Manufacturing Bits: Nov. 16

By Mark LaPedus - 16 Nov, 2021 - Comments: 0

New hybrid EUV photoresist The U.S. Department of Energy (DOE) has announced the winners for a recent entrepreneurial technology competition, including the development of a new EUV hybrid resist and an antibody therapeutics platform. The event, called the National Lab Accelerator Pitch Event, involved a competition among 11 researchers within the DOE’s national labs. Researchers pitched ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 12 Nov, 2021 - Comments: 0

Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

Manufacturing Bits: Nov. 8

By Mark LaPedus - 08 Nov, 2021 - Comments: 0

Plasma R&D with quantum computing Rigetti Computing, a developer of quantum computers, has been selected to lead a quantum simulation project for the development of fusion energy. The project was awarded by the Department of Energy (DoE). Under the plan, Rigetti will collaborate with Lawrence Livermore National Laboratory and the University of Southern California on a three-year, $3.1 m... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 05 Nov, 2021 - Comments: 0

Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more

Manufacturing Bits: Nov. 2

By Mark LaPedus - 02 Nov, 2021 - Comments: 0

IRDS lithography roadmap The Journal of Micro/Nanopatterning, Materials, and Metrology (JM3) has published a paper that outlines the lithography roadmap and the various challenges for the next 15 years. The paper, called the "International Roadmap for Devices and Systems lithography roadmap," projects that extreme ultraviolet (EUV) lithography and a next-generation version will remain the m... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 29 Oct, 2021 - Comments: 0

Chipmakers After years in the works, GlobalFoundries is finally a public company. But on its first day of trading on Thursday (Oct. 28), shares of the foundry vendor slipped a bit. GF finished its first day of trading at $46.40. This compares to the $47 per share it priced in the initial public offering (IPO), according a report to Reuters. The chipmaker has a market capitalization of about $2... » read more

3D Printing For More Circuits

By Ann R. Thryft - 27 Oct, 2021 - Comments: 0

After several years of experimentation, and growing success in volume manufacturing for some use cases, technologies for 3D printing of electronic circuits are becoming more common. Some innovations in processes and materials are moving these technologies closer to mainstream electronics manufacturing. Christopher Tuck, professor of material science at the University of Nottingham, observed ... » read more

Manufacturing Bits: Oct. 26

By Mark LaPedus - 26 Oct, 2021 - Comments: 0

GaN finFETs, scaling GaN At the upcoming IEEE International Electron Devices Meeting (IEDM) in San Francisco, a slew of entities will present papers on the latest technologies in R&D. The event, to be held Dec. 11–15, involve papers on advanced packaging, CMOS image sensors, interconnects, transistors, power devices and other technologies. At IEDM, Intel will present a paper on a GaN-... » read more

Scaling Bump Pitches In Advanced Packaging

By Mark LaPedus - 25 Oct, 2021 - Comments: 0

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

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category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Semiconductor Manufacturing Equipment And Measures To Protect The Earth’s Environment

Manufacturing Bits: Nov. 16

Week In Review: Manufacturing, Test

Manufacturing Bits: Nov. 8

Week In Review: Manufacturing, Test

Manufacturing Bits: Nov. 2

Week In Review: Manufacturing, Test

3D Printing For More Circuits

Manufacturing Bits: Oct. 26

Scaling Bump Pitches In Advanced Packaging