category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Samsung PM9A3 All Flash Reference Platform
By Samsung - 14 Dec, 2022 - Comments: 0

Software Defined Storage continues to gain momentum in the modern datacenter storage market. As datacenter storage in- frastructures and technologies evolve, the need for speed and flexibility in the storage system becomes evident. NVMe is at the forefront of these advancements. Weka is a software defined storage system that is designed to meet the needs of today’s I/O intensive workloads. It... » read more

Increased Photomask Density And Its Impact On EDA
By Ed Sperling - 13 Dec, 2022 - Comments: 0

The ability to print curvilinear shapes on photomasks can have big repercussions on semiconductor design. Aki Fujimura, CEO of D2S, explains why mask rule checking has been bound by complex design rules, and why curvilinear shapes are important for reducing margin and simplifying the chip design process. » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 09 Dec, 2022 - Comments: 2

The more than 1,400 attendees at this week’s IEDM, which celebrated the 75th anniversary of the transistor, were clearly focused on making the next 75 years of semiconductors even more remarkable than the last. Intel, Samsung, TSMC, STMicroelectronics, GlobalFoundries and imec announced breakthrough devices, materials, and even integration approaches. These included: Intel showcased adva... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 02 Dec, 2022 - Comments: 0

With the European Council’s adoption of its negotiating mandate for the European Chips Act, member states and the Czech Presidency of the Council have reached a critical milestone in supporting Europe’s efforts to advance manufacturing and supply of critical components, while bolstering R&D capacities for development of next-generation semiconductor innovations, according to SEMI. Ch... » read more

Making Chips Yield Faster At Leading-Edge Nodes
By Ed Sperling - 30 Nov, 2022 - Comments: 0

Simulation for semiconductor manufacturing is heating up, particularly at the most advanced nodes where data needs to be analyzed in the context of factors such as variation and defectivity rates. Semiconductor Engineering sat down with David Fried, corporate vice president of computational products at Lam Research, to talk about what's behind Lam's recent acquisition of Esgee Technologies, ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 18 Nov, 2022 - Comments: 0

Chinese memory chip maker YMTC and dozens of other Chinese entities are "at risk" of being added to a trade blacklist as soon as Dec. 6, a U.S. Commerce Department official said in prepared remarks seen by Reuters. SMIC co-CEO Zhao Haijun said on an earnings call that recent export controls from the United States will have an "adverse impact" on the company's production. The U.K. has rule... » read more

The Rise Of Copper Wires In Automotive ICs
By Prasad Dhond - 17 Nov, 2022 - Comments: 0

In 2011, the price of Gold (Au) surged to $1900/oz which had a drastic impact on Wirebonded ICs using Au wires. IC suppliers scrambled to convert from Au to copper (Cu) wire on as many products as they could. However, automotive ICs were reluctant to make the jump due to lack of reliability data and performance track-record. However, today’s automotive ICs are big users of Cu wires driven by ... » read more

Challenges In Backside Power Delivery
By Laura Peters - 17 Nov, 2022 - Comments: 0

One of the key technologies to enable scaling below 3nm involves delivering of power on the backside of a chip. This novel approach enhances signal integrity and reduces routing congestion, but it also creates some new challenges for which today there are no simple solutions. Backside power delivery (BPD) eliminates the need to share interconnect resources between signal and power lines on t... » read more

High-NA EUV Complicates EUV Photomask Future
By Jan Willis - 17 Nov, 2022 - Comments: 0

The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported EUV fueling growth of the semiconductor photomask industry while a panel of experts cited a number of complications in moving to High-NA EUV during an event co-located with the SPIE Photomask Technology Conference in late September. Industry luminaries representing 44 companies from across the semiconductor ecosystem partic... » read more

Hot Trends In Semiconductor Thermal Management
By Karen Heyman - 17 Nov, 2022 - Comments: 1

Increasing thermal challenges, as the industry moves into 3D packaging and continues to scale digital logic, are pushing the limits of R&D. The basic physics of having too much heat trapped in too small a space is leading to tangible problems, like consumer products that are too hot to hold. Far worse, however, is the loss of power and reliability, as overheated DRAM has to continually r... » read more

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