category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

The Benefits Of Curvilinear Shapes On Photomasks
By Jan Willis - 15 Mar, 2021 - Comments: 0

Do you have four minutes to hear why companies like Micron Technology think that curvilinear shapes on photomasks are an advantage? In a short video, Ezequiel Russell, Senior Director of Mask Technology at Micron Technology shows how curvilinear shapes can increase process windows for advanced memory as shown in figure 1. The video was part of a longer panel discussion with industry experts at ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Mar, 2021 - Comments: 0

Government policy For the last four years, the U.S. and China have been embroiled in a trade war, especially on the technology front. The U.S. has implemented a number of export control measures and tariffs in the arena. But there might be a thawing in the tense relationship between the two superpowers. “Reports surfaced Thursday indicating the China Semiconductor Industry Association (CSIA)... » read more

Changing The Rules For Chip Scaling
By Ed Sperling - 10 Mar, 2021 - Comments: 0

Aki Fujimura, CEO of D2S, talks with Semiconductor Engineering about the incessant drive for chip density, how to improve that density through other means than just scaling, and why this is so important for the chip industry. » read more

Manufacturing Bits: March 8
By Mark LaPedus - 08 Mar, 2021 - Comments: 0

Two-beam EUV lithography At the recent SPIE Advanced Lithography conference, Nikon gave a presentation on a two-beam extreme ultraviolet (EUV) lithography technology. Still in the conceptual phase, Nikon’s so-called EUV Projection Optical Wafer Exposure Ruling Machine, or EUV Power Machine, is designed for the 1nm node or so. The proposed system has a minimum resolution of 10nm for lines ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Mar, 2021 - Comments: 0

Government policy The National Security Commission on Artificial Intelligence (NSCAI) this week submitted its final report to Congress and the President. The goal is to develop a national strategy to maintain America’s AI advantages related to national security. As part of the long and complex report, the NSCAI came to a sobering conclusion: “The U.S. government is not prepared to defend t... » read more

The Future Of FinFETs At 5nm And Beyond
By Assawer Soussou - 05 Mar, 2021 - Comments: 0

While contact gate pitch (GP) and fin pitch (FP) scaling continues to provide higher performance and lower power to finFET platforms, controlling RC parasitics and achieving higher transistor performance at technology nodes of 5nm and beyond becomes challenging. In collaboration with Imec, we recently used SEMulator3D virtual fabrication to explore an end-to-end solution to better underst... » read more

Manufacturing Bits: March 2
By Mark LaPedus - 02 Mar, 2021 - Comments: 0

Next-gen AFM At the recent SPIE Advanced Lithography conference, Imec, Infinitesima and others described a new metrology tool technology called a Rapid Probe Microscope (RPM). Infinitesima has shipped its first RPM 3D system, enabling three-dimensional (3D) metrology applications for leading-edge chips. The system was jointly developed with Imec. In the IEDM paper, Imec and Infinitesima... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Feb, 2021 - Comments: 0

Chipmakers and OEMs Several chipmakers have not resumed production in their fabs in Texas for the second consecutive week. This follows power outages due to a major winter storm. As reported, a severe winter storm hit many parts of the United States, including Texas. Last week, utility providers began to prioritize service to residential areas in Austin, Texas. As a result, electricity and ... » read more

Manufacturing Bits: Feb. 23
By Mark LaPedus - 23 Feb, 2021 - Comments: 0

Space crystals Northrop Grumman recently launch its Cygnus spacecraft into space, sending thousands of pounds of critical supplies and experiments to the International Space Station (ISS). The launch, which took place from NASA’s Wallops Flight Facility in Virginia, will deliver a diversity of experiments to the ISS National Laboratory. In one experiment, Redwire’s sixth in-space man... » read more

Brazil Paves New Semiconductor Path
By Mark LaPedus - 22 Feb, 2021 - Comments: 3

After struggling to get its semiconductor industry off the ground for the last several years, Brazil finally may have found its place in the market with the development of IC design services, memory modules and packaging. Brazil exists well under the radar when it comes to semiconductors. But with little or no fanfare, the nation over the years has been trying to build fabs, assemble chips a... » read more

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