category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Unleashing The Power Of Test Through Data
By James Guilmart - 12 Dec, 2023 - Comments: 0

In the relentless pursuit of technological innovation, test engineers find themselves facing ever-increasing pressures to deliver flawless products at an unprecedented pace. From the rapid evolution of autonomous vehicles to the advent of 5G and beyond, the demands on engineering teams continue escalating. While organizations strive to optimize their testing processes, the need for efficient te... » read more

Mission Profile Analytics For The Automotive Industry
By Dan Alexandrescu - 12 Dec, 2023 - Comments: 0

The automotive industry is undergoing a major transformation with the rise of electrification, connectivity, and autonomous driving capabilities fueling the need for a greater number of more advanced semiconductors. The associated regulatory expectations are also creating challenging safety and reliability requirements for automotive-grade silicon that need to be understood and managed over a w... » read more

Deploying Cutting-Edge Adaptive Test Analytics Apps
By Ken Butler - 12 Dec, 2023 - Comments: 0

By Ken Butler, Advantest, and Guy Cortez, Synopsys Semiconductor test challenges abound in this era of AI. As such, semiconductor test engineering is increasingly moving towards fully adaptive test where each device receives the “right” test content to assess its correctness. Advantest and Synopsys have partnered to provide new cutting-edge real-time adaptive test applications at the te... » read more

Using In-Chip Monitoring And Deep Data Analytics For High Bandwidth Memory (HBM) Reliability And Safety
By proteanTecs - 12 Dec, 2023 - Comments: 0

Since its introduction in 2014, High Bandwidth Memory (HBM) has been poised to address the growing demand for high-performance, high capacity, and low latency memories required by High-Performance Computing (HPC), high-performance graphic processors (GPU), and artificial intelligence (AI). Since then, bandwidth and capacity requirements have increased with each new generation: HBM2, HBM2e and n... » read more

Achieving Automotive Reliability With Advanced Monitoring Solutions
By Gal Carmel - 12 Dec, 2023 - Comments: 0

In today's automotive landscape, the integration of advanced software and hardware has transformed vehicles into complex data-driven machines. Sensors like cameras, radars, and lidars constantly monitor the vehicle's surroundings, feeding data to electronic control units that enable advanced driver assistance features like adaptive cruise control, lane-keeping assistance, and collision avoid... » read more

Leveraging IBIS-AMI Models To Optimize PCIe 6.0 Designs
By Synopsys - 12 Dec, 2023 - Comments: 0

The exploding demand for more data driven by advancements such as artificial intelligence and machine learning has created an increase in bandwidth (BW) for interconnects for different systems and hardware components such as graphic cards, network cards, storge devices, CPUs, memories, and many more. PCIe is the leading high-speed serial communication protocol for connecting such hardware compo... » read more

Fluid Dispensing For Packaging Today’s Devices
By Nordson Test And Inspection - 12 Dec, 2023 - Comments: 0

Fluid dispensing systems are evolving in order to address the challenges that system-in-package (SiP) and micromechanical systems (MEMS) packages face, especially in regard to tight geometries and assembly processes. These packages, used in smartphones, have become more miniaturized, and as a result, have created added value in the market. However, they include a variety of small dies or dev... » read more

Applying ML In Failure Analysis
By Anne Meixner - 20 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran H... » read more

Total Overlay With Multiple RDLs
By Ed Sperling - 13 Nov, 2023 - Comments: 0

As Advanced IC Substrates (AICS) add more RDL layers, requiring additional via connections between the RDL layers, the potential for cumulative overlay shift increases. This overlay shift can lead to longer RDL traces, which increases interconnect resistance, resulting in lower yield. Keith Best, director of product marketing, for lithography at Onto Innovation, talks about total overlay — th... » read more

New Insights Into IC Process Defectivity
By Laura Peters - 07 Nov, 2023 - Comments: 1

Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be problematic at each new node, but now they are persistent problems at several nodes and in advanced packaging, where there may be a mix of different technologies. In addition, there are more proc... » read more

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