category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

Monitor, Test, And Repair For Multi-Die Health And Reliability
By Yervant Zorian - 09 Sep, 2025 - Comments: 0

Ever since the earliest semiconductor devices, silicon health has been a concern. Systems manufacturers wanted to be sure that their chips worked properly before being soldered onto printed circuit boards (PCBs). They put pressure on semiconductor suppliers to test wafers, individual dies, and assembled parts before they were shipped. A wide range of design-for-test (DFT) approaches were develo... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

Same Chip, Two Destinies: How Power Profiles Improve With On-Chip Monitoring
By Eyal Fayneh - 09 Sep, 2025 - Comments: 0

What happens to critical power-related considerations when the same chip is handled two different ways, with or without visibility from within? This article begins by examining how the absence of on-chip monitoring impacts peak power, average power, and Di/Dt noise (rate of current change), as illustrated in the diagram below and the subsequent discussion. It then details how these aspects c... » read more

Challenges In Stacking HBM
By Ed Sperling - 03 Sep, 2025 - Comments: 1

AI data centers are pushing for higher density in high-bandwidth memory. Today, the maximum number of layers that can be stacked is 8, but that increases to as many as 24 layers by 2030. The big challenge will be in the interconnects, and making sure the microbumps align. At 16 layers, the bump pitch will be less than 10 microns, and the dies will be thinner. Damon Tsai, head of product marketi... » read more

Comprehensive Process Control Solutions For Through-Glass Vias
By Monita Pau - 12 Aug, 2025 - Comments: 0

At some point in our lives, we have dropped a drinking glass or knocked over a glass-blown knickknack, only to watch it hit the floor and shatter into pieces. We learn from any early age that glass is fragile. But if glass is so fragile, why are manufacturers adopting glass core substrates? Good question. And one that comes with a ready answer. Glass is able to meet the new, denser line-s... » read more

The Painful Reality Of Scaling Cloud AI
By Alex Burlak - 12 Aug, 2025 - Comments: 0

The shift to Generative AI (GenAI) has overwhelmed existing infrastructure, transforming previously rare issues into daily operational realities. Skyrocketing costs, intense energy consumption, and hardware failures at unprecedented scales illustrate the strain of current AI workloads. With models like GPT-4 costing tens of millions and GPT-5 projected to surpass a billion-dollar threshold, the... » read more

Advanced Electrical Test Capability For Better Defect Signature Detection In Advanced Package Development
By Jesse Ko - 12 Aug, 2025 - Comments: 0

As the semiconductor world excitingly explores the potential of new advanced package solutions for their intricate and novel designs, challenges arise from undetected defects caused by the complexity of the designs and the lack of accessibility to the interconnects for testing. This typically results in a long cycle time to achieve yield entitlement. Undetected defects at the development stage ... » read more

Transforming Test For Co-packaged Optics
By Laura Peters - 12 Aug, 2025 - Comments: 0

Data centers are undergoing a dramatic transformation to reduce the power consumption of high-speed data transmissions by 70% or more with co-packaged optics. By moving optical transceivers from the fronts of racks into the same package as the networking switch and HBMs, AI programs that used to take a week to run can now be completed in a day. To enable this change in production manufacturi... » read more

Secure Data Sharing To Promote Collaboration
By Christophe Begue - 12 Aug, 2025 - Comments: 0

As the semiconductor industry evolves toward a $1-trillion revenue milestone by 2030, fueled largely by AI applications, its challenges have magnified—a globalized supply chain, increasingly complex chip architectures and mounting cybersecurity demands. Assessing how data collaboration occurs within the ecosystem is essential, while secure data collaboration facilitated by cutting-edge pla... » read more

Metrology Under Pressure: Detecting Defects in Fine-Pitch Hybrid Bonding
By Gregory Haley - 12 Aug, 2025 - Comments: 1

As advanced packaging pushes deeper into the sub-10µm realm, traditional inspection and metrology systems are being forced to evolve with it. Hybrid bonding, a critical enabler of vertical integration and 3D system performance, relies on exceptionally tight alignment and defect-free bonding surfaces. But as interconnect pitch shrinks, even nanometer-scale variations in height, tilt, or cont... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy