category: Test, Measurement and Analytics

category: IoT, Security & Automotive

The Glass Substrate Question: When Will It Replace Copper Clad Laminate?
By Keith Best - 12 Sep, 2023 - Comments: 0

"When will glass replace copper clad laminate on advanced IC substrates?" That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s take an advanced IC substrate (AICS) refresher. In other words, how did we get to the point where glass substrat... » read more

The Growing Importance Of PMIC Validation
By Kaitlynn Mazzarella - 12 Sep, 2023 - Comments: 0

In the ever-evolving world of technology, the semiconductor industry plays a pivotal role in shaping the devices we use daily. Among the countless components that make up these devices, Power Management Integrated Circuits (PMICs) have emerged as unsung heroes, silently ensuring the efficient use of power resources. PMICs are specialized integrated circuits designed to manage and regulate th... » read more

Automotive Safety Requires PVT Monitoring IP Within Semiconductor ICs
By Rohan Bhatnagar - 12 Sep, 2023 - Comments: 0

The modern automobile, especially with the move toward more electrification, presents huge challenges to the designers of vehicular electronics. Gone are the days of mechanical issues and oil changes being primary concerns. Today’s automobile has a high number of semiconductor chips performing functions for self-driving autonomous systems, advanced driver assistance systems (ADAS), connectivi... » read more

Test Strategies In The Era Of Heterogeneous Integration
By Fisher Zhang - 12 Sep, 2023 - Comments: 0

Moore’s Law, the observation that the number of transistors on an integrated circuit doubles approximately every two years, is critical to advances in computing technology. For decades, fabs have managed to achieve exponential growth in digital capability and transistor density by making transistors smaller and smaller, but we’ve hit the physical limits of these processes. Today, new proces... » read more

MMAF Option Enables Picoampere Measurements
By Yoshiyuki Aoki - 12 Sep, 2023 - Comments: 0

By Yoshiyuki Aoki and Tsunetaka Akutagawa Demand for low-current devices is increasing, as many new sensors are being created for medical, automotive, industrial, and other applications. Chief among the heightened production and test requirements for these low-current devices is the need to achieve picoampere (pA)-class measurements. Sensors’ functionality and efficacy, especially in medic... » read more

Improving Reliability In Chips
By Anne Meixner - 12 Sep, 2023 - Comments: 1

Semiconductor Engineering sat down to discuss changes in test that address tracing device quality throughout a product’s lifetime with Tom Katsioulas, CEO at Archon Design Solutions and U.S. Department of Commerce IoT advisory board member; Ming Zhang, vice president of R&D Acceleration at PDF Solutions; and Uzi Baruch, chief strategy officer at proteanTecs. What follows are excerpts of t... » read more

Synopsys Timing Constraints Manager: Constraint Verification
By Synopsys - 11 Sep, 2023 - Comments: 0

Constraint verification refers to the verification of the contents of an SDC file to flag situations where the specified constraints are either incorrect, or incomplete, both of which, if not addressed, could result in silicon failure. The key to constraint verification is the ability to flag real issues without swamping an engineer with noise: issues that upon designer review result in no chan... » read more

proteanTecs On-Chip Monitoring And Deep Data Analytics System
By proteanTecs - 11 Sep, 2023 - Comments: 0

High reliability applications in service-critical markets, such as autonomous driving and cloud computing, demand maximum performance and minimal power and cost. Reducing design margins while maintaining high reliability becomes imperative. State-of-the-art silicon processes offer mainly logic density improvements at limited speedup. Worst-case design analysis is not cost effective anymore. ... » read more

Chip Industry Week In Review
By The SE Staff - 08 Sep, 2023 - Comments: 0

By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with Q1, according to SEMI. Similarly, the top 10 semiconductor foundries reported a 1.1% quarterly-over-quarter revenue decline in Q2. A rebound is anticipated in Q3, according to TrendForce. Synopsys extended its AI-driven EDA ... » read more

Manual X-ray Inspection
By Ed Sperling - 28 Aug, 2023 - Comments: 0

Increased density in advanced node chips and advanced packaging offers a way to greatly improve performance and reduce power, but it also makes it harder to inspect these devices for real and latent defects. Higher density can lead to scattering of light, and heterogeneous integration in a package means it’s not always possible to see through all materials equally. Chris Rand, product line ma... » read more

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