category: Test, Measurement and Analytics

category: Auto, Security & Edge AI

AI Predictive Modeling Tools Move Into Critical Role To Leverage AI, ML
By John Kibarian - 10 Dec, 2024 - Comments: 0

The semiconductor industry, as always, is at the forefront of transformational technological innovation, driving escalating complexity of manufacturing processes that extend time-to-market delivery, inflate research and development costs, and lead to expensive delays when problems arise. As manufacturers navigate these challenges, the need for comprehensive prediction of manufacturing proble... » read more

Gas Analysis For A Greener Tomorrow
By Antonia Eckert - 10 Dec, 2024 - Comments: 0

In our quest for a sustainable future, monitoring and managing air quality and greenhouse gases have become more critical than ever. Advanced technology plays a pivotal role in this endeavor. By providing the tools needed to understand and mitigate environmental impacts, we aim towards a greener tomorrow. The MGA Series from MIRO Analytical are laser-based gas analyzers designed for prec... » read more

Testing For Thermal Issues Becomes More Difficult
By Gregory Haley - 10 Dec, 2024 - Comments: 0

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it much more difficult to identify and test for thermal issues in advanced packages. For a single SoC, compressing higher functionality into a smaller area concentrates the processing and makes thermal effects more predictable. But that processing can happen anywhere in a... » read more

Speeding Up Acoustic Wafer Inspection
By Ed Sperling - 09 Dec, 2024 - Comments: 0

Higher density and more vertical layers require higher-resolution inspection. In the past that generally resulted in longer scan times, which can slow throughput in the fab or assembly house. Bryan Schackmuth, senior product line manager at Nordson Test & Inspection, explains how rotational scanning using acoustic wafer inspection can speed up inspection time by a factor of eight, why it is... » read more

Getting The Biggest ROI On Your Digital Twin
By Sean King - 12 Nov, 2024 - Comments: 0

In the semiconductor industry, digital twins are the focus of a lot of attention, with substantial investments from industry players and governments alike. This year the European Union and the United States have pledged hundreds of millions of dollars in grants and funding opportunities, including the new CHIPS Digital Twin Manufacturing USA Institute. Ultimately, many people see great value in... » read more

Extending Chip Lifetime With Safer Voltage Scaling
By Eyal Fayneh - 12 Nov, 2024 - Comments: 0

What if your chips lived 20% longer without compromising performance, and even while reducing power consumption? How would it affect your product’s reliability and cost? What would be the effect on your profitability? With the demand for longer-lasting chips growing across industries, designers and reliability engineers face increasing pressure to ensure their products perform correctly fo... » read more

Power-Aware Test Vector Porting For Production ATE
By Hari Mani - 12 Nov, 2024 - Comments: 0

Power management in contemporary system-on-chip (SoC) designs is almost unimaginably complex. Processors and other chip cores turn on and off as needed. Advanced features such as dynamic voltage and frequency scaling (DVFS) can adjust to changing conditions and incrementally adjust power and performance on the fly. Power management starts from the lowest hardware level of transistor structures ... » read more

AI’s Ability To Deliver Breakthroughs Across Semiconductor Design And Manufacturing
By John Kibarian - 12 Nov, 2024 - Comments: 0

AI holds great promise for our industry. It will help close the divide between design, manufacturing and test that is required to effectively produce today’s most advanced hybrid devices. One way to look at the potential impact of AI in the semiconductor industry is to realize that it is more and more driven by software engineering. When designing a chip, it’s essentially like writing... » read more

Advanced Packaging Drives Test And Metrology Innovations
By Gregory Haley - 12 Nov, 2024 - Comments: 1

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

Yield Management Embraces Expanding Role
By Laura Peters - 12 Nov, 2024 - Comments: 0

Competitive pressures, shrinking time-to-market windows, and increased customization are collectively changing the dynamics and demands for yield management systems, shifting left from the fab to the design flow and right to assembly, packaging, and in-field analysis. The basic role of yield management systems is still expediting new product introductions, reducing scrap, and delivering grea... » read more

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