category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Analysis Of Pattern Distortion By Panel Deformation And Addressing It By Using Extremely Large Exposure Field Fine-Resolution Lithography
By Onto Innovation - 11 Oct, 2022 - Comments: 0

The growing demand for heterogeneous integration is driven by the 5G market. This includes smartphones, data centers, servers, high-performance computing (HPC), artificial intelligence (AI) and internet of things (IoT) applications. Next-generation packaging technologies require tighter overlay to accommodate larger package sizes with fine-pitch chip interconnects on large-format flexible panel... » read more

The Future Of Connectivity Is Higher Data Rates And Micro-Positioning
By David Vondran - 11 Oct, 2022 - Comments: 0

These days, we tend to take global wireless connectivity for granted. Whether we’re in a coffee shop, a hotel room, or a plane at 35,000 feet, chances are that we’ll be able to enjoy Internet access at reasonable speeds. But despite this constant connectedness, we still manage to misplace our keys and forget where we left our smartphones. New connectivity technologies are promising to ha... » read more

Quantification Of Steels And Alloys Using A Dual Source Multidetector System On SEM
By Bruker - 11 Oct, 2022 - Comments: 0

The accurate and precise analysis of steels and alloys is essential for understanding their mechanical and thermal properties. Such materials often have a wide range of elements at various concentrations down to trace ppm levels. Accordingly, it is not possible to determine the concentrations of all elements with a standard scanning electron microscope (SEM) and an energy dispersive spectromete... » read more

GUC GLink Test Chip Uses In-Chip Monitoring And Deep Data Analytics For High Bandwidth Die-To-Die Characterization
By proteanTecs - 11 Oct, 2022 - Comments: 0

Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized interconnect solution for both CoWoS and InFO packaging technologies. The GUC and proteanTecs collaboration started with GUC’s second generation of GLink, known as GLink 2.0. The project target was... » read more

The Development Of Front-End Module For 5G Millimeter-Wave Device Testing
By Advantest - 11 Oct, 2022 - Comments: 0

This article describes the development of a front-end module for 5G millimeter-wave device testing. 5G millimeter-wave is planned to be used up to the 53 GHz band. Our challenges are to optimize the performance of our test system up to that frequency band including wide power range of EVM performance, and to add a new one-port S-Parameter measurement function. We describe the elemental technolo... » read more

Hunting For Macro Defects: The Importance Of Bare Wafer Inspection
By Aseem Srivastava - 08 Sep, 2022 - Comments: 0

As logic and memory semiconductor devices approach the limits of Moore’s Law, the requirements for accuracy in layer transfer become increasingly stringent. One leading silicon wafer manufacturer estimates that 50% of epitaxial wafer supply for logic will be on nodes equal to or less than 7nm. This is up approximately 30% from earlier in the decade. To meet the demands of extreme ultraviol... » read more

Making 5G More Reliable
By Ed Sperling - 08 Sep, 2022 - Comments: 0

The rollout of 5G is a complex and monumental effort involving multiple separate systems that need to function flawlessly together in real-time, making it difficult to determine where problems might arise, or how and when to test for them. Investments in 5G have been underway for the better part of a decade, and the technology is considered the next huge growth opportunity for mobile devices... » read more

Test Data Streaming For The Next Generation Of Designs
By Rahul Singhal - 08 Sep, 2022 - Comments: 0

Semiconductor chips have been evolving to meet the demands of rapidly transforming applications, and so has the test technology to meet the test goals of those chips. Going back two decades or so, the applications were limited and the designs were simpler, thus the concerns about power, performance and area (PPA), turn-around time, re-use and time-to-market, etc., were important but not as crit... » read more

Enabling Test Strategies For 2.5D, 3D Stacked ICs
By Laura Peters - 08 Sep, 2022 - Comments: 0

Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

The Future Of Wireless Test Is Over The Air
By David Vondran - 08 Sep, 2022 - Comments: 0

The deployment of mmWave technology is synonymous with 5G rollout and the initial results for faster links are amazing. For example, using a mmWave band, the prospects of a 1-2 Gbps link means a typical HD movie can download in less than a minute. An upload link of 30 Mbps also enables the transfer of videos back to the cloud at a record pace. These user experiences are enabled by the antenna l... » read more

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