category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Controller Area Network (CAN) Overview
By NI - 06 Aug, 2024 - Comments: 0

What is CAN? A controller area network (CAN) bus is a high-integrity serial bus system for networking intelligent devices. CAN busses and devices are common components in automotive and industrial systems. Using a CAN interface device, you can write LabVIEW applications to communicate with a CAN network. CAN History Bosch originally developed CAN in 1985 for in-vehicle networks.... » read more

Expediting Manufacturing Safe Launch With Big Data AI/ML Analytic Solutions On The Cloud
By PDF Solutions - 06 Aug, 2024 - Comments: 0

With highly competitive time-to-market and time-to-volume windows, IC suppliers need to be able to release new product to production (NPI) in a timely manner with competitive manufacturing metrics. Manufacturing yield, test time and quality are important metrics in NPI to Manufacturing safe launch. A powerful yield management system is crucial to achieve the goal metrics. In this paper, recomme... » read more

The Semiconductor Revolution And The Role Of Adaptable Testing
By Juan Valdivia - 09 Jul, 2024 - Comments: 0

The semiconductor industry, the backbone of modern technology, is experiencing a rapid evolution driven by the increasing demands for higher performance, greater functionality, and lower power consumption. This evolution is creating new challenges and opportunities in the testing of mixed signal and RF semiconductors and electronics devices, making the need for adaptable and flexible test syste... » read more

Reducing Design Margins With Silicon Model Calibration
By Guy Cortez - 09 Jul, 2024 - Comments: 0

By Guy Cortez and Mark Laird It’s no secret to anyone that chip design gets harder every year. There are two major trends driving these ever-increasing challenges. The first is the continual scaling down to smaller design nodes. Although the pace of new node introduction has slowed somewhat in recent years, the impact of each new geometry and process is more dramatic than ever before. Acce... » read more

Effective Monitoring, Test, and Repair of Multi-Die Designs
By Synopsys - 09 Jul, 2024 - Comments: 0

Despite clear advantages, there are numerous new challenges that need to be addressed for successful multi-die realization. The multi-die test challenges include: Bare chiplet level (pre-bond) Probe, dedicated/functional pads for test Test, diagnosis, and repair Interconnects (mid/post-bond) Die-to-die test access Lane test, diagnosis, and repair Multi-die ... » read more

Delivering On Power During HPC Test
By Anne Meixner - 09 Jul, 2024 - Comments: 0

The industry’s insatiable need for power in high-performance computing (HPC) is creating problems for test cells, which need to deliver very high currents at very consistent voltage levels through the power delivery network (PDN). In response, ATE, wafer probe, and contactor vendors are introducing some innovative approaches and test procedures that can ensure robust power delivery to ATE pro... » read more

Digital Twins Find Their Footing In IC Manufacturing
By Laura Peters - 09 Jul, 2024 - Comments: 0

Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. The movement toward digital twins opens up a slew of opportunities, from building and equipping new fabs faster to speeding yield ramps by reducing the number of silicon-based tes... » read more

Testing PAs under Digital Predistortion and Dynamic Power Supply Conditions
By NI - 09 Jul, 2024 - Comments: 0

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In this application note, you will learn different techniques for testing PAs through an interactive application note with multiple how-to videos. To address these linearity and efficiency requirements,... » read more

X-ray Inspection Becoming Essential In Advanced Packaging
By Gregory Haley - 09 Jul, 2024 - Comments: 0

X-ray technology is moving into the mainstream of chip manufacturing as complex assemblies and advanced packaging make it increasingly difficult to ensure these devices will work as expected throughout their lifecycles. A single defect in a chiplet or interconnect can transform a complex advanced package into expensive scrap, and the risk only increases as the chip industry shifts from homog... » read more

Automotive Semiconductors Require Integrated Test Solution
By Toni Dircherl - 09 Jul, 2024 - Comments: 0

The automotive semiconductor test market is experiencing organic growth as chipmakers produce higher volumes of devices serving an array of automotive applications. In addition, the range of applications for automotive-grade semiconductors is evolving as the technology advances. Manufacturers of automated test equipment (ATE) are adapting to ensure their systems can handle devices ranging from ... » read more

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