category: Research: LPHP

category: IoT, Security & Automotive

Research Bits: Mar. 11
By Jesse Allen - 11 Mar, 2024 - Comments: 0

Ferroelectric nanosheets Engineers from the University of Sydney, RMIT University, University of New South Wales, and University of Technology Sydney created a liquid metal alloy of tin, zirconium, and hafnium. The alloy has a thin oxide layer crust that enables it to be used to harvest ultra-thin tin oxide nanosheets doped with hafnium zirconium oxide, which could then be 2D printed on a subs... » read more

Chip Industry Technical Paper Roundup: Mar. 5
By Linda Christensen - 05 Mar, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=201 /] » read more

Research Bits: Mar. 5
By Jesse Allen - 05 Mar, 2024 - Comments: 0

Anti-ambipolar transistor Materials scientists from the City University of Hong Kong propose using transistors made of mixed-dimensional nanowires and nanoflakes to create multivalued logic devices. By combining GaAsSb nanowires and MoS2 nanoflakes, the team created a hetero-transistor with anti-ambipolar transfer characteristics, in which positive (holes) and negative (electron) charge car... » read more

Research Bits: Feb. 27
By Jesse Allen - 27 Feb, 2024 - Comments: 0

Phonon-magnon reservoir Researchers from TU Dortmund, Loughborough University, V. E. Lashkaryov Institute of Semiconductor Physics, and University of Nottingham were inspired by the human eye to propose an on-chip phonon-magnon reservoir for neuromorphic computing. In reservoir computing, input signals are mapped into a multidimensional space, which is not trained and only expedites recogni... » read more

Research Bits: Feb. 19
By Jesse Allen - 19 Feb, 2024 - Comments: 0

DNA assembly of 3D nanomaterials Scientists from Brookhaven National Laboratory, Columbia University, and Stony Brook University developed a method that uses DNA to instruct molecules to organize themselves into targeted 3D patterns and produce a wide variety of designed metallic and semiconductor 3D nanostructures. “We have been using DNA to program nanoscale materials for more than a de... » read more

Chip Industry Technical Paper Roundup: Feb. 19
By Liz Allan - 19 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=199 /] More ReadingTechnical Paper Library home » read more

Chip Industry Technical Paper Roundup: Feb. 13
By Liz Allan - 13 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=197 /] More ReadingTechnical Paper Library home » read more

Research Bits: Feb. 13
By Jesse Allen - 13 Feb, 2024 - Comments: 0

Fast phase-change memory Researchers from Stanford University, TSMC, National Institute of Standards and Technology (NIST), and University of Maryland developed a new phase-change memory for future AI and data-centric systems. It is based on GST467, an alloy of four parts germanium, six parts antimony, and seven parts tellurium, which is sandwiched between several other nanometer-thin material... » read more

Research Bits: Feb. 6
By Jesse Allen - 06 Feb, 2024 - Comments: 0

Laser printer for photonic circuits Researchers from the University of Washington and University of Maryland propose a faster, cheaper way to fabricate and reconfigure photonic integrated circuits. The method uses a laser writer to write, erase, and modify circuits into a thin film of phase-change material similar to what is used for recordable CDs and DVDs. The researcher say the method co... » read more

Chip Industry Technical Paper Roundup: Feb. 6
By Liz Allan - 06 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=187 /] More ReadingTechnical Paper Library home » read more

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