Chip Industry Technical Paper Roundup: Mar. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=410 /] Find more semiconductor research papers here. » read more

Research Bits: Mar. 4


Fiber computer Researchers from Massachusetts Institute of Technology (MIT), Rhode Island School of Design, and Brown University developed a programmable elastic fiber computer that could be woven into clothing to monitor health conditions and physical activity. Clothing created using the fiber computer was reported as comfortable and machine washable. The single elastic fiber computer cont... » read more

Research Bits: Feb. 25


Recording synaptic connections Researchers from Harvard University built a silicon chip capable of recording synaptic signals from a large number of neurons and used it to catalogue more than 70,000 synaptic connections from about 2,000 rat neurons. They hope the device is a step in creating a detailed synaptic connection map of the brain. The chip contains an array of 4,096 microhole elect... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

Research Bits: Feb. 18


Predicting band gap with neural networks Researchers from Kyoto University developed a machine learning model to predict the band gap of novel semiconductor materials. Using data from almost 2,000 semiconductor materials, the team tested six different neural networks. They found that the incorporation of conditional generative adversarial networks (CGAN) and message passing neural networks ... » read more

Chip Industry Technical Paper Roundup: Feb. 18


New technical papers recently added to Semiconductor Engineering’s library: [table id=406 /] Find all technical papers here. » read more

Chip Industry Technical Paper Roundup: Feb. 10


New technical papers recently added to Semiconductor Engineering’s library: [table id=405 /] Find all technical papers here. Also find more research and latest news here. » read more

Research Bits: Feb. 10


Speeding up 3D NAND etch Researchers from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Laboratory (PPPL) investigated ways to speed up the cryogenic reactive ion etching process for 3D NAND by using a combined hydrogen fluoride gas to create the plasma. “Cryo etch with the hydrogen fluoride plasma showed a significant increase in the etching rate compared... » read more

Research Bits: Feb. 4


High-power diamond transistors Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for high-power electronics that remains switched off by default. The performance of the diamond was improved by coating it in hydrogen atoms followed by layers of aluminum oxide. “The challenge for power electronics is that the design of the... » read more

Chip Industry Technical Paper Roundup: Feb. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

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