category: Research

category: IoT, Security & Automotive

Chip Industry Technical Paper Roundup: Nov. 11
By Linda Christensen - 11 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=381 /] More Reading Technical Paper Library » read more

Chip Industry Technical Paper Roundup: Nov. 5
By Linda Christensen - 05 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=378 /]   Further Reading Chip Industry Week In Review Silicon Valley design center and NY EUV Accelerator; Siemens’ big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si-based power wafer; $100M funding for AI; trade wars escalate; earnings rep... » read more

Research Bits: Nov. 5
By Jesse Allen - 05 Nov, 2024 - Comments: 0

Optical in-memory computing Researchers from the University of Pittsburgh, University of California Santa Barbara, University of Cagliari, and Institute of Science Tokyo propose a resonance-based photonic architecture which leverages the non-reciprocal phase shift in magneto-optical materials to implement photonic in-memory computing. “The materials we use in developing these cells have b... » read more

Chip Industry Technical Paper Roundup: Oct. 29
By Linda Christensen - 29 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=375 /] More Reading Chip Industry Week In Review Intel’s EU court win; high-NA benchmarks and new maskless litho; SiC down, GaN up; Natcast’s plan; Xiaomi’s 3nm chip; semi tax credit rules; RISC-V; lithium mine; AI-edge expansion. Technical Paper Library home » read more

Research Bits: Oct. 29
By Jesse Allen - 29 Oct, 2024 - Comments: 0

Micro-LED DUV maskless lithography Researchers from the University of Science and Technology of China, Anhui GaN Semiconductor, and Wuhan University developed a vertically integrated micro-LED array for deep ultraviolet (DUV) maskless photolithography. The team fabricated a DUV display integrated chip with 564 pixels-per-inch density that uses a three-dimensional vertically integrated devic... » read more

Research Bits: Oct. 22
By Jesse Allen - 22 Oct, 2024 - Comments: 0

3D-printed active electronics Researchers from MIT demonstrated fully 3D-printed semiconductor-free resettable fuses. Produced using standard 3D printing hardware and an inexpensive, biodegradable polymer filament doped with copper nanoparticles, the device can perform the same switching functions as the semiconductor-based transistors used for processing operations in active electronics. A... » read more

Chip Industry Technical Paper Roundup: Oct. 22
By Linda Christensen - 22 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Chip Industry Technical Paper Roundup: Oct. 14
By Linda Christensen - 14 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=367 /] More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Research Bits: Oct. 14
By Liz Allan - 14 Oct, 2024 - Comments: 0

Si-photonics chip emits beam of light MIT researchers developed a miniature, chip-based “tractor beam” that could help scientists study DNA, classify cells, and investigate the mechanisms of disease. The device uses a beam of light emitted by a silicon-photonics chip to manipulate particles millimeters away from the chip surface, while the sample remains sterile under its glass cover. T... » read more

Research Bits: Oct. 8
By Liz Allan - 08 Oct, 2024 - Comments: 0

Soft, flexible polymer semiconductors Stanford University materials scientists used a specialized electron microscope – cryo-electron microscopy (Cryo 4D-STEM) – to explore the microstructure of soft semiconductors that could lead to new-generation electronics. Organic mixed ionic-electronic conductors (OMIECs) are soft, flexible polymer semiconductors with promising electrochemical qua... » read more

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