Chip Industry’s Technical Paper Roundup: July 12


New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

Research Bits: July 5


UTe2 breakthrough for quantum computing Scientists from the Macroscopic Quantum Matter Group laboratory at the University College Cork (UCC) in Ireland discovered a spatially modulating superconducting state in the superconductor uranium ditelluride (UTe2) that could be useful as in topological quantum computing. Using a powerful quantum microscope, the team found that the some of the electro... » read more

Chip Industry’s Technical Paper Roundup: July 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Chip Industry’s Technical Paper Roundup: June 27


New technical papers added to Semiconductor Engineering’s library this week. [table id=113 /]   » read more

Research Bits: June 20


Quantum takes a Helium 3 bath A team of researchers from National Physical Laboratory, Royal Holloway University of London, Chalmers University of Technology, and Google have found that immersing superconducting quantum circuits in a bath of Helium-3 (3He) can cool down quantum circuits to almost 100 times lower than was possible before, to achieve under a thousand of a degree above absolute z... » read more

Chip Industry’s Technical Paper Roundup: June 20


New technical papers added to Semiconductor Engineering’s library this week. [table id=112 /] » read more

Chip Industry’s Technical Paper Roundup: June 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=109 /] Further Reading Technical Paper Home » read more

Research Bits: June 13


Converting heat to electricity Researchers at the National Institute of Standards and Technology (NIST) and University of Colorado Boulder fabricated a device to boost the conversion of heat into electricity. The technique involves depositing hundreds of thousands of microscopic columns of gallium nitride atop a silicon wafer. Layers of silicon are then removed from the underside of the waf... » read more

Research Bits: June 5


Improving memristors Researchers at Los Alamos National Laboratory (LANL) have demonstrated a reliable Interface-type (IT) memristive device (memristor) that shows promise as a technique for building artificial synapses in neuromorphic computing. The team made its memristor — a component that which combines memory and programming functions — using a simple Au/Nb-doped SrTiO3 (Nb:STO) Sc... » read more

Chip Industry’s Technical Paper Roundup: June 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=105 /] More Reading Technical Paper Library home » read more

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