Usage Of Pulse-Edge Transformer In Secondary Controlled Flyback Applications


The pulse-edge transformer (PET) is used as a medium to transmit PWM pulses from a secondary-side controller, such as EZ-PD™ PAGxS, to a primary-side controller, such as EZ-PD™ PAGxP, for AC/DC applications targeting the power adapter segment. This article explains the advantages of PET over the conventional opto-coupler based approach. Click here to read more. » read more

Securing Automotive Ethernet With MACsec Silicon IP


In today’s cars, the Ethernet standard is the go-to solution for connecting zonal gateways to the central compute units that handle ADAS functionality. However, in-vehicle networks are vulnerable to a number of security threats, including eavesdropping, denial-of-service attacks, man-in-the middle attacks, and unauthorized access. This white paper explores how MACsec provides an effective sol... » read more

How Quickly Will Multi-Die Systems Change Semiconductor Design?


For many decades, semiconductor design and implementation has been focused on monolithic, ever-larger and more complex single-chip implementation. This system-on-chip approach is now changing for a variety of reasons. The new frontier utilizes many chips assembled in new ways to deliver the required form-factor and performance. Multi-die systems are paving the way for new types of semiconduc... » read more

Data Collection For Edge AI / Tiny ML With Sensors


Reality AI software from Renesas provides solution suites and tools for R&D engineers who build products and internal solutions using sensors. Working with accelerometers, vibration, sound, electrical (current/voltage/ capacitance), radar, RF, proprietary sensors, and other types of sensor data, Reality AI software identifies signatures of events and conditions, correlates changes in signat... » read more

Taking eFPGA Security To The Next Level


Security is an important topic for every SOC, but it’s especially salient in the context of high-risk assets included in the eFPGA for obfuscation. Whether the device is used in defense systems or in cars driving around town, encryption is important so the device remains secure and can’t be modified maliciously, whether through physical attacks or remote hacking. There are several different... » read more

Die-To-Die Security


Security concerns are growing as more chiplets or die are added into a package. There are more possible attack points, and data is becoming increasingly valuable, which makes a successful attack much more lucrative than in the past. Mike Borza, Synopsys scientist, talks about the impact of heterogeneous integration on security, what the risks are for multi-tenant data centers, and what happens ... » read more

Chip Industry Week In Review


By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan The U.S. Department of Defense (DOD) announced $238 million in awards toward establishing eight regional innovation hubs under the CHIPS and Science Act. The hubs aim to accelerate hardware prototyping and "lab-to-fab" transition of semiconductor technologies for secure edge/IoT, 5G/6G, AI hardware, quantum technology, electromagnetic warfare, and ... » read more

Quantum Plus AI Widens Cyberattack Threat Concerns


Quantum computing promises revolutionary changes to the computing paradigm that the semiconductor industry has operated under for decades, but it also raises the prospect of widespread cybersecurity threats. Quantum computing cyberattacks will occur millions of times faster than any assault conventional computing can muster. And while quantum computing is in an early stage of development, ex... » read more

Chip Industry Week In Review


By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

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