category: System-Level Design

category: IoT, Security & Automotive

Design Optimal ESD Protection With Context-Aware SPICE Simulation
By Neel Natekar - 29 Aug, 2024 - Comments: 0

Electrostatic discharge (ESD) is a major reliability concern for modern ICs. Ensuring the robustness of ICs in an ESD event by providing adequate ESD protection is proving to be a major challenge for IC designers due to factors such as shrinking of the design features, reduction in gate oxide thickness, increase in the contact and interconnect resistance and an increase in the overall design co... » read more

Streamlining Complex Semiconductor Designs With IP-XACT-Based Structured Assembly
By Insaf Meliane - 29 Aug, 2024 - Comments: 0

Semiconductor design is rapidly evolving because technologies such as AI and machine learning (ML) applications push the boundaries of complexity and specialization. Modern chips require hundreds or thousands of IP blocks, leading to significant design challenges. Multi-die architectures, which distribute functional blocks across multiple dice, demand expert planning to ensure connectivity and ... » read more

PCIe Over Optical: Transforming High-Speed Data Transmission
By David Kulansky - 29 Aug, 2024 - Comments: 0

With the rise in AI requiring new computing models and enhanced data transmission methods to cope, the necessity for innovative, high-performance, and low-latency connectivity solutions has never been more apparent. PCIe over Optical is set to play a key role in enabling the growth of AI, and here we examine some of the intricacies of PCIe over Optical to explore its implementation, challenges,... » read more

Energy Efficiency As A Native Network Attribute Through 6G
By Michele Robinson-Pontbriand - 29 Aug, 2024 - Comments: 0

Energy efficiency offers positive societal benefits in both environmental and economic ways, such as lowering pollutants and utility bills. As such, the global community is looking toward technological advancements to help drive a more sustainable future. One such technology that offers opportunities in this space is 6G. Utilizing its unparalleled speed and connectivity, and powered by the tran... » read more

AI’s Role In Chip Design Widens, Drawing In New Startups
By Karen Heyman - 29 Aug, 2024 - Comments: 0

Using AI in EDA is reinvigorating the whole tools industry, prompting established players to upgrade their tool offerings with AI/ML features, while drawing in startups trying to carve out differentiated approaches to fill unaddressed gaps with new tools and methodologies. Today’s new generation of entrepreneurs is comprised of both young post-grads with innovative ideas and industry veter... » read more

Edge Devices Require New Security Approaches
By Adam Kovac - 29 Aug, 2024 - Comments: 0

The diversity of connected devices and chips at the edge — the vaguely defined middle ground between the end point and the cloud — is significantly widening the potential attack surface and creating more opportunities for cyberattacks. The edge build-out has been underway for at least the past half-decade, largely driven by an explosion in data and increasing demands to process that data... » read more

GDDR7: The Ideal Memory Solution In AI Inference
By Frank Ferro - 29 Aug, 2024 - Comments: 1

The generative AI market is experiencing rapid growth, driven by the increasing parameter size of Large Language Models (LLMs). This growth is pushing the boundaries of performance requirements for training hardware within data centers. For an in-depth look at this, consider the insights provided in "HBM3E: All About Bandwidth". Once trained, these models are deployed across a diverse range of... » read more

Defining The Chiplet Socket
By Brian Bailey - 29 Aug, 2024 - Comments: 0

Experts At The Table: The semiconductor industry has been buzzing with the possibilities surrounding chiplets, but so far this packaging technology has been confined to large semiconductor companies that are vertically integrated. The industry has been attempting to open this up to a broader group of people. To work out what this means for chiplets, and what standardization will be required, Se... » read more

Accelerating The Pace And Precision Of AI Chip Innovation
By Stelios Diamantidis - 29 Aug, 2024 - Comments: 0

The Hot Chips 2024 conference, which took place this week in Silicon Valley, was a showcase for AI chip innovation. The three-day program illustrated the race among both established chipmakers and new entrants to explore advanced architectures and embrace novel design solutions to deliver the next breakthrough AI processor. In this article, I share a few “hot takes” from the conference that... » read more

Ready For Curvilinear: New Innovations For Resistance Extraction
By Siemens EDA - 29 Aug, 2024 - Comments: 0

The rapid evolution of semiconductor industry, fueled by the propagation of IOT applications, image sensors, photonics and MEMS applications and other emerging technologies dramatically increased the complexity of IC design. Designers often use unconventional structures to achieve the desired functionality and optimal performance. For example, image sensors use wide polygons in the layout and a... » read more

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