category: Manufacturing

category: IoT, Security & Automotive

Review of essential use of fluorochemicals in lithographic patterning and semiconductor processing
By Technical Paper Link - 06 Apr, 2022 - Comments: 0

New academic paper by researchers from Cornell University.   Abstract "We identify and describe categories of fluorochemicals used to produce advanced semiconductors within the lithographic patterning manufacturing processes. Topics discussed include the per- and polyfluoroalkyl substance (PFAS) materials used and their necessary attributes for successful semiconductor manufacturing... » read more

Qubits made by advanced semiconductor manufacturing
By Technical Paper Link - 29 Mar, 2022 - Comments: 0

Abstract: "Full-scale quantum computers require the integration of millions of qubits, and the potential of using industrial semiconductor manufacturing to meet this need has driven the development of quantum computing in silicon quantum dots. However, fabrication has so far relied on electron-beam lithography and, with a few exceptions, conventional lift-off processes that suffer from low yie... » read more

An achromatic X-ray lens
By Technical Paper Link - 15 Mar, 2022 - Comments: 0

Abstract "Diffractive and refractive optical elements have become an integral part of most high-resolution X-ray microscopes. However, they suffer from inherent chromatic aberration. This has to date restricted their use to narrow-bandwidth radiation, essentially limiting such high-resolution X-ray microscopes to high-brightness synchrotron sources. Similar to visible light optics, one way t... » read more

Pinpointing the Dominant Component of Contact Resistance to Atomically Thin Semiconductors
By Technical Paper Link - 08 Mar, 2022 - Comments: 0

Abstract "Achieving good electrical contacts is one of the major challenges in realizing devices based on atomically thin two-dimensional (2D) semiconductors. Several studies have examined this hurdle, but a universal understanding of the contact resistance and an underlying approach to its reduction are currently lacking. In this work we expose the shortcomings of the classical contact resist... » read more

Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices
By Technical Paper Link - 19 Feb, 2022 - Comments: 0

Abstract "As smaller structures are being increasingly adopted in the semiconductor industry, the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking and stacking strategies. Owing to the increasing complexity of the design architectures, optical metrology techniques including spectroscopic ellipsometry (SE) and ref... » read more

Warpage Of Compression Molded SiP Strips
By JCET - 17 Feb, 2022 - Comments: 0

By Eric Ouyang, Yonghyuk Jeong, JaeMyong Kim, JaePil Kim, OhYoung Kwon, and Michael Liu of JCET; and Susan Lin, Jenn An Wang, Anthony Yang, and Eric Yang of CoreTech System (Moldex3D). Abstract System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing p... » read more

Topology for Substrate Routing in Semiconductor Package Design
By Technical Paper Link - 15 Feb, 2022 - Comments: 0

Abstract: In this work, we propose a new signal routing method for solving routing problems that occur in the design process of semiconductor package substrates. Our work uses a topological transformation of the layers of the package substrate in order to simplify the routing problem into a problem of connecting points on a circle with non-intersecting straight line segments. The circle, whi... » read more

Non-destructive Thickness Characterisation of 3D Multilayer Semiconductor Devices Using Optical Spectral Measurements and Machine Learning
By Technical Paper Link - 07 Feb, 2022 - Comments: 0

Abstract: "Three-dimensional (3D) semiconductor devices can address the limitations of traditional two-dimensional (2D) devices by expanding the integration space in the vertical direction. A 3D NOT-AND (NAND) flash memory device ispresently the most commercially successful 3D semiconductor device. It vertically stacks more than 100 semiconductor material layers to provide more storage capac... » read more

X-ray Imaging of Silicon Die Within Fully Packaged Semiconductor Devices
By Technical Paper Link - 21 Jan, 2022 - Comments: 0

Abstract: "X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Analog Devices AD9253 die initially falls, but after 100 °C, it rises again. The twist across the die wafer falls linearly with an incre... » read more

Screen Printed Chipless RFID Tags on Packaging Substrates
By Technical Paper Link - 20 Jan, 2022 - Comments: 0

Abstract: "A chipless radio frequency identification (RFID) tag is a suitable low-cost alternative to any chip-based RFID one. The flexibility to use low-cost printing techniques makes chipless RFID a competitive technology. In this paper, we report an evaluation of the microwave performance of two different screen-printed chipless tags in the 3–6 GHz range. The tags were designed and scre... » read more

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