category: Top Stories

category: IoT, Security & Automotive

How Hardware Can Bias AI Data
By Ed Sperling - 10 Sep, 2019 - Comments: 1

Clean data is essential to good results in AI and machine learning, but data can become biased and less accurate at multiple stages in its lifetime—from moment it is generated all the way through to when it is processed—and it can happen in ways that are not always obvious and often difficult to discern. Blatant data corruption produces erroneous results that are relatively easy to ident... » read more

Test On New Technology’s Frontiers
By Ed Sperling And Susan Rambo - 10 Sep, 2019 - Comments: 2

Semiconductor testing is getting more complicated, more time-consuming, and increasingly it requires new approaches that have not been fully proven because the technologies they are addressing are so new. Several significant shifts are underway that make achieving full test coverage much more difficult and confidence in the outcome less certain. Among them: Devices are more connected an... » read more

Nvidia’s Top Technologists Discuss The Future Of GPUs
By Ed Sperling And Susan Rambo - 10 Sep, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the role of the GPU in artificial intelligence, autonomous and assisted driving, advanced packaging and heterogeneous architectures with Bill Dally, Nvidia’s chief scientist, and Jonah Alben, senior vice president of Nvidia’s GPU engineering, at IEEE’s Hot Chips 2019 conference. What follows are excerpts of that conversation. SE: There are ... » read more

August 2019 Startup Funding Report
By Jeff Dorsch - 09 Sep, 2019 - Comments: 0

Last month, 18 startups received private funding rounds of $100 million or more. Software and cybersecurity startups were once again popular, while automotive, mobility, artificial intelligence/machine learning, and agriculture-related technology also saw a good deal of funding. Analytics, energy, Internet of Things, and robotics startups drew new funding, too. Those 18 companies together to... » read more

Autonomous Vehicles Are Reshaping The Tech World
By Kevin Fogarty - 05 Sep, 2019 - Comments: 0

The effort to build cars that can drive themselves is reshaping the automotive industry and its supply chain, impacting everything from who defines safety to how to ensure quality and reliability. Automakers, which hardly knew the names of their silicon suppliers a couple of years ago, are now banding together in small groups to share the costs and solve technical challenges that are well be... » read more

The Race For Better Computational Software
By Ed Sperling - 05 Sep, 2019 - Comments: 0

Anirudh Devgan, president of Cadence, sat down with Semiconductor Engineering to talk about computational software, why it's so critical at the edge and in AI systems, and where the big changes are across the semiconductor industry. What follows are excerpts of that conversation. SE: There is no consistent approach to how data will be processed at the edge, in part because there is no consis... » read more

Challenges To Building Level 5 Automotive Chips
By Ann Mutschler - 05 Sep, 2019 - Comments: 0

It’s an exciting time in the automotive space, and this is especially true when it comes to all of the activity around autonomous driving and the path to achieving full Level 5 autonomy. The technology is complex, the ecosystem seems to get more complex by the day, and simulating autonomous systems safely makes this an extremely fascinating area from an engineering perspective. At the heart o... » read more

IP’s Growing Impact On Yield And Reliability
By Ann Mutschler - 04 Sep, 2019 - Comments: 0

Chipmakers are finding it increasingly difficult to achieve first-pass silicon with design IP sourced internally and from different IP providers, and especially with configurable IP. Utilizing poorly qualified IP and waiting for issues to appear during the design-to-verification phase just before tape-out can pose high risks for design houses and foundries alike in terms of cost and time to... » read more

New Technologies To Support 3D-ICs
By Brian Bailey - 04 Sep, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss changes required throughout the ecosystem to support three-dimensional (3D) chip design with Norman Chang, chief technologist for the Semiconductor Business Unit of ANSYS; John Park, product management director for IC packaging and cross-platform solutions at Cadence; John Ferguson, director of marketing for DRC applications at Mentor, a Siemens Bus... » read more

On The Cusp Of 5G
By Kevin Fogarty - 29 Aug, 2019 - Comments: 0

Carriers and chipmakers are celebrating the rollout of the first standards-compliant commercial 5G services. "We are, officially in the era of 5G," said John Smee, vice president of engineering at Qualcomm at the recent 5G Summit at IEEE's International Microwave Symposium (IMS) in Boston. Movement is happening on the commercial end. Major U.S. carriers Verizon, AT&T and Sprint have set ... » read more

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