category: Top Stories

category: IoT, Security & Automotive

Node Within A Node
By Ed Sperling - 24 Jul, 2019 - Comments: 0

Enough margin exists in manufacturing processes to carve out the equivalent of a full node of scaling, but shrinking that margin will require a collective push across the entire semiconductor manufacturing supply chain. Margin is built into manufacturing at various stages to ensure that chips are manufacturable and yield sufficiently. It can include everything from variation in how lines are... » read more

Using Memory Differently To Boost Speed
By Ed Sperling - 22 Jul, 2019 - Comments: 2

Boosting memory performance to handle a rising flood of data is driving chipmakers to explore new memory types and different ways of using existing memory, but it also is creating some complex new challenges. For most of the semiconductor design industry, memory has been a non-issue for the past couple of decades. The main concerns were price and size, but memory makers have been more than a... » read more

Partitioning Drives Architectural Considerations
By Ann Mutschler - 19 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss partitioning with Raymond Nijssen, vice president of system engineering at Achronix; Andy Ladd, CEO at Baum; Dave Kelf, chief marketing officer at Breker; Rod Metcalfe, product management group director in the Digital & Signoff Group at Cadence; Mark Olen, product marketing group manager at Mentor, a Siemens Business; Tom Anderson, technical mar... » read more

200mm Cools Off, But Not For Long
By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

Challenges Grow For 5G Packages And Modules
By Mark LaPedus - 18 Jul, 2019 - Comments: 0

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC packages and RF modules for 5G phones are more complex and expensive than today's devices, and that gap will grow significantly in the second phase of 5G. In addition, 5G devices will require an as... » read more

Creating 2D Compounds
By Katherine Derbyshire - 18 Jul, 2019 - Comments: 1

A 2D material, by definition, has no surface dangling bonds. A bulk material with plate-like structure, such as graphite, is composed of thin layers with a weakly bonded cleavage plane between. What this means is a monolayer of graphite will seek to satisfy its exposed dangling bonds by absorbing other materials. A monolayer of graphene, in contrast, is energetically complete without a secon... » read more

Breaking Down The Debug Process
By Brian Bailey - 17 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss debugging complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. Part one can be found here. What fol... » read more

Low-Power Design Becomes Even More Complex
By Ann Mutschler - 16 Jul, 2019 - Comments: 0

Throughout the SoC design flow, there has been a tremendous amount of research done to ease the pain of managing a long list of power-related issues. And while headway has been made, the addition of new application areas such as AI/ML/DL, automotive and IoT has raised as many new problems as have been solved. The challenges are particularly acute at leading-edge nodes where devices are power... » read more

Will In-Memory Processing Work?
By Brian Bailey - 16 Jul, 2019 - Comments: 1

The cost associated with moving data in and out of memory is becoming prohibitive, both in terms of performance and power, and it is being made worse by the data locality in algorithms, which limits the effectiveness of cache. The result is the first serious assault on the von Neumann architecture, which for a computer was simple, scalable and modular. It separated the notion of a computatio... » read more

June’19 Startup Funding
By Jeff Dorsch - 11 Jul, 2019 - Comments: 0

During the month of June, there were 15 startups that brought in funding rounds of $100 million or more, as investors continued to chase deals in cybersecurity, automotive technology, semiconductors, and a variety of services. There were no billion-dollar deals as spring slid into summer; yet, those 15 companies together raised a total of about $3.13 billion. Aurora Innovation, the developer... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy