category: Top Stories

category: IoT, Security & Automotive

RISC-V Wants All Your Cores
By Brian Bailey - 12 Oct, 2023 - Comments: 0

RISC-V is no longer content to disrupt the CPU industry. It is waging war against every type of processor integrated into an SoC or advanced package, an ambitious plan that will face stiff competition from entrenched players with deep-pocketed R&D operations and their well-constructed ecosystems. When Calista Redmond, CEO for RISC-V International, said at last year's summit that RISC-V w... » read more

Partitioning Processors For AI Workloads
By Ann Mutschler - 12 Oct, 2023 - Comments: 0

Partitioning in complex chips is beginning to resemble a high-stakes guessing game, where choices need to extrapolate from what is known today to what is expected by the time a chip finally ships. Partitioning of workloads used to be a straightforward task, although not necessarily a simple one. It depended on how a device was expected to be used, the various compute, storage and data paths ... » read more

CXL: The Future Of Memory Interconnect?
By Karen Heyman - 12 Oct, 2023 - Comments: 1

Momentum for sharing memory resources between processor cores is growing inside of data centers, where the explosion in data is driving the need to be able to scale memory up and down in a way that roughly mirrors how processors are used today. A year after the CXL Consortium and JEDEC signed a memorandum of understanding (MOU) to formalize collaboration between the two organizations, suppor... » read more

Using Smart Data To Boost Semiconductor Reliability
By Laura Peters - 10 Oct, 2023 - Comments: 0

The chip industry is looking to AI and data analytics to improve yield, operational efficiency, and reduce the overall cost of designing and manufacturing complex devices. In fact, SEMI estimates its members could capture more than $60B in revenues associated through smart data use and AI. Getting there, however, requires overcoming a number of persistent obstacles. Smart data utilization is... » read more

Integration Challenges For ATE Data
By Gregory Haley - 10 Oct, 2023 - Comments: 0

Tighter integration of automatic test equipment (ATE) into semiconductor manufacturing, so that data from one process can be seamlessly leveraged by another, holds significant promise to boost manufacturing efficiency and yield. The challenge is selling this concept to fabs, packaging houses, and their customers. Data involving yield parameters, process variations, and intricate details abou... » read more

Streamlining Failure Analysis Of Chips
By Anne Meixner - 10 Oct, 2023 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss how increasing complexity in semiconductor and packaging technology is driving shifts in failure analysis methods, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; Mike McIntyre, director of product management in the Enterprise Business Unit at Onto Innovation; Kamran Hak... » read more

Startup Funding: September 2023
By Jesse Allen - 09 Oct, 2023 - Comments: 0

Chip-to-chip and data center I/O drew investor interest in September, including support for several startups developing Compute Express Link (CXL) solutions. Elsewhere in the data center, several large rounds went to companies developing AI accelerators. And at the edge, startups are building unique ways to handle AI at very little power by initially processing data directly at the sensor. O... » read more

How Much AI Is Really Needed?
By John Koon - 05 Oct, 2023 - Comments: 0

Tensor Core GPUs have created a generative AI model gold rush. Whether it’s helping students with math homework, planning a vacation, or learning to prepare a six-course meal, generative AI is ready with answers. But that's only one aspect of AI, and not every application requires it. AI — now an all-inclusive term, referring to the process of using algorithms to learn, predict, and make... » read more

Making Sensors More Reliable
By Karen Heyman - 05 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the latest issues in sensors with Prakash Madhvapathy, director of product marketing, Tensilica audio/voice DSPs group at Cadence; Kevin Hughes, senior product manager for MEMS sensors at Infineon; and Matthew Hogan, product management director at Siemens EDA. What follows are excerpts of that conversation. [L-R] Kevin ... » read more

Gearing Up For Level 4 Vehicles
By John Koon - 05 Oct, 2023 - Comments: 0

More autonomous features are being added into high-end vehicles, but getting to full autonomy will likely take years more effort, a slew of new technologies — some of which are not in use today, and some of which involve infrastructure outside the vehicle — along with sufficient volume to bring the cost of these combined capabilities down to an affordable price point. In the meantime, ma... » read more

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