Glitch Power Issues Grow At Advanced Nodes


An estimated 20% to 40% of total power is being wasted due to glitch in some of the most advanced and complex chip designs, and at this point there is no single best approach for how and when to address it, and mixed information about how effective those solutions can be. Glitch power is not a new phenomenon. DSP architects and design engineers are well-versed in the power wasted by long, sl... » read more

The Future Of Memory


Experts at the Table: Semiconductor Engineering sat down to talk about the impact of off-chip memory on power and heat, and what can be done to optimize performance, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; a... » read more

Startup Funding: December 2023


Photonics and optics were strong in December, with investors funding two different companies using photonic technologies to develop AI chips and interconnects. Another key area — metaoptics — combines what traditionally would be separate lenses and optical components into a single, flat nanopatterned device. Metaoptics are being deployed in applications ranging from AI processing and sensor... » read more

Glass Substrates Gain Foothold In Advanced Packages


Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still plenty of problems to solve before this approach becomes mainstream. While glass itself is cheap and shares some important physical similarities to silicon, there are challenges with buildup, stre... » read more

Pressure Builds On Failure Analysis Labs


Failure analysis labs are becoming more fab-like, offering higher accuracy in locating failures and accelerating time-to-market of new devices. These labs historically have been used for deconstructing devices that failed during field use, known as return material authorizations (RMAs), but their role is expanding. They now are becoming instrumental in achieving first silicon and ramping yie... » read more

Plugging Gaps In The IC Supply Chain


Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

SRAM’s Role In Emerging Memories


Experts at the Table — Part 3: Semiconductor Engineering sat down to talk about AI, the latest issues in SRAM, and the potential impact of new types of memory, with Tony Chan Carusone, CTO at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be ... » read more

Visa Shakeup On Tap To Help Solve Worker Shortage


Governments around the world are racing to train workers to design, manufacture, and package chips, but they are facing a talent shortfall that is expected to continue despite their best efforts — particularly for those engineers capable of designing and producing the most advanced chips. The Semiconductor Industry Association (SIA) predicts a U.S. chip worker shortfall of 67,000 by 2030, ... » read more

How Secure Are FPGAs?


The unique hybrid software/hardware nature of FPGAs makes them tempting targets for cyberattacks, while also enabling them to rebuff attacks and change the attack surface before significant damage can be done. But it's becoming increasingly challenging to address all the potential vulnerabilities. FPGAs are often included in larger systems, each with their own unique attack vectors as well a... » read more

Trendspotting: Automotive IC Startup Funding In 2023


Consumers expect a lot from the electronics in their cars. The parts in the safety-critical systems need to be reliable for up to 18 years, able to handle a range of temperatures, voltages, and vibrations — and all the while be fault-tolerant and make zero errors. On top of those basic requirements, automakers trying to appeal to consumers are adding in more features that communicate with the... » read more

← Older posts Newer posts →