category: Top Stories

category: IoT, Security & Automotive

Mapping Heat Across A System
By Ann Mutschler - 13 May, 2021 - Comments: 0

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

What’s Next In Fab Tool Technologies?
By Mark LaPedus - 12 May, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss extreme ultraviolet (EUV) lithography and other next-generation fab technologies with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fuj... » read more

Chip Monitoring And Test Collaborate
By Bryon Moyer - 11 May, 2021 - Comments: 0

As on-chip monitoring becomes more prevalent in complex advanced-node ICs, it’s easy to question whether or not it conflicts with conventional silicon testing. It might even supplant such testing in the future. Or alternatively, they could interact, with each supporting the other. “On-chip monitors provide fine-grained observability into effects and issues that are otherwise difficult or... » read more

Testing Analog Circuits Becoming More Difficult
By Susan Rambo - 11 May, 2021 - Comments: 1

Foundries and packaging houses are wrestling how to control heat in the testing phase, particularly as devices continue to shrink and as thermally sensitive analog circuits are added into SoCs and advanced packages to support everything from RF to AI. The overriding problem is that heat can damage chips or devices under test. That's certainly true for digital chips developed at advanced node... » read more

Chasing Test Escapes In IC Manufacturing
By Anne Meixner - 11 May, 2021 - Comments: 0

The number of bad chips that slip through testing and end up in the field can be significantly reduced before those devices ever leave the fab, but the cost of developing the necessary tests and analyzing the data has sharply limited adoption. Determining an acceptable test escape metric for an IC is essential to improving the yield-to-quality ratio in chip manufacturing, but what exactly is... » read more

Standards, Open Source, and Tools
By Brian Bailey - 10 May, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering discussed what open source verification means today and what it should evolve into with Jean-Marie Brunet, senior director for the Emulation Division at Siemens EDA; Ashish Darbari, CEO of Axiomise; Simon Davidmann, CEO of Imperas Software; Serge Leef, program manager in the Microsystems Technology Office at DARPA; Tao Liu, staff hardware engineer... » read more

Developers Turn To Analog For Neural Nets
By Bryon Moyer - 06 May, 2021 - Comments: 1

Machine-learning (ML) solutions are proliferating across a wide variety of industries, but the overwhelming majority of the commercial implementations still rely on digital logic for their solution. With the exception of in-memory computing, analog solutions mostly have been restricted to universities and attempts at neuromorphic computing. However, that’s starting to change. “Everyon... » read more

IC Security Threat Grows As More Devices Are Connected
By Ann Mutschler - 06 May, 2021 - Comments: 0

Designing for security is beginning to gain traction across a wider swath of chips and systems as more of them are connected to the Internet and to each other, sometimes in safety- and mission-critical markets where the impact of a cyber attack can be devastating. But it's also becoming more difficult to design security into these systems. Unlike in the past, connectivity is now considered e... » read more

Battle Brewing Over Automotive Display Protocols
By Bryon Moyer - 06 May, 2021 - Comments: 0

Displays are multiplying in new and future automobiles. That means a lot more display data moving around the vehicle and traveling some distance between sensor and processor. While existing protocols can handle some of the new duties, new protocols also are being developed specifically for this application. “Automotive displays are proliferating, increasing in numbers and in pixel densi... » read more

Steep Spike For Chip Complexity And Unknowns
By Ed Sperling - 05 May, 2021 - Comments: 0

Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

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