GaN Application Base Widens, Adoption Grows


Gallium nitride (GaN) is beginning to show up across a broad range of power semiconductor applications due to its wide bandgap, enabling fast-charging, very high speeds, and much smaller form factors than silicon-based chips. Unlike silicon carbide (SiC), another wide-bandgap technology, GaN is a lateral rather than a vertical device. GaN tops out at about 900 volts, which limits its use in ... » read more

Batteries Have Moving Parts


The race is on to make lithium-ion batteries safer, to increase the amount of energy that can be drawn out of these devices, and to reduce the time it takes to charge them up again. Transistors and other electronic components depend on the movement of electrons, which are effectively massless and dimensionless relative to the semiconductor, metal, and dopant atoms that surround them. A batte... » read more

Business, Technology Challenges Increase For Photomasks


Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

Securing Short-Range Communications


Short-range wireless communication technology is in widespread use and growing rapidly, adding conveniences for consumers while also opening the door to a whole range of cyberattacks. This technology is common across a variety of applications, from wireless key fobs to unlock a car and start the ignition, to tags used to help drivers find misplaced items such as car keys. RFID also is starti... » read more

Revving Up SiC And GaN


Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

Amdahl Limits On AI


Software and hardware both place limits on how fast an application can run, but finding and eliminating the limitations is becoming more important in this age of multicore heterogeneous processing. The problem is certainly not new. Gene Amdahl (1922-2015) recognized the issue and published a paper about it in 1967. It provided the theoretical speedup for a defined task that could be expected... » read more

Can Coherent Optics Reduce Data-Center Power?


As optical bandwidth requirements increase, system designers are turning to “coherent” modulation schemes that can place more data on the same laser light, and lower power over long connections. A newer question is whether those savings could be achieved for short connections within data centers, as well. “Coherent is the direction everything's moving, because for a given system and... » read more

Innovations In Sensor Technology


Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

Big Changes Ahead For Inside Auto Cabins


The space we occupy inside our vehicles is poised to change from mere enclosure to participant in the driving experience. Whether for safety or for comfort, a wide range of sensors are likely to appear that will monitor the “contents” of the vehicle. The overall approach is referred to as an in-cabin monitoring system (ICMS), but the specific applications vary widely. “In-cabin sensing... » read more

Using Manufacturing Data To Boost Reliability


As chipmakers turn to increasingly customized and complex heterogeneous designs to boost performance per watt, they also are demanding lower defectivity and higher yields to help offset the rising design and manufacturing costs. Solving those issues is a mammoth multi-vendor effort. There can be hundreds of process steps in fabs and packaging houses. And as feature sizes continue to shrink, ... » read more

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