Crossover To Memory Expansion With Adesto EcoXiP and NXP’s i.MX RT Crossover Processors


The ‘Crossover Processor’ integrates attributes of a microprocessor such as higher CPU speeds, multimedia interfaces and expandable memory into a microcontroller form factor built for cost effectiveness and fastest development time. This new crossover processor class of device provides embedded developers the ability to solve many problems in today’s fast-moving technology markets. To ... » read more

Testing Post


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Manufacturing Bits: Dec. 18


Gallium oxide breakthroughs Crystalline beta gallium oxide is a promising wide bandgap semiconductor material. It has a large bandgap of 4.8–4.9 eV with a high breakdown field of 8 MV/cm. The technology has a high voltage figure of merit, which is more than 3,000 times greater than silicon, more than 8 times greater than silicon carbide (SiC) and more than 4 times greater than that of... » read more

Cost Analysis of a Wet Etch TSV Reveal Process


Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved performance and can enable new, innovative designs not previously possible. To scale this valuable technology and spark industry adoption, there is a need to refine and optimize the TSV reveal process to red... » read more

designHUB: Design Reuse Made Real


It’s no secret: You can’t get to market quickly or efficiently without integrating and re-using IP technology in your system-on-chip (SoC) design. In the past 10 years alone, design re-use has doubled to the point where today you’ll find more than 150 reused blocks comprising 60-70% of the die area in an average SoC. The companies most successful with their IP-reuse strategies are thos... » read more

Cure The Common Cold…


The technology sector has no equal in the ability of its people to visualize what might be possible and then make it happen fast. If we were sorting out the common cold, the sniffles may already have been relegated to the past. Maybe that’s a claim too far but while imagining the future has always been a feature of our world I think we’ve gone into overdrive in the last few years. From a... » read more

The Week in Review: IoT


Cybersecurity Cybersecurity concerns continued to generate news this week. Symantec reported a corporate espionage hacking campaign against manufacturers of medical supplies, dubbing the efforts “Orangeworm.” The hackers have attacked 24 or more targets this year, and almost 100 since 2015, according to the security software and services firm. Meanwhile, the House Energy and Commerce Co... » read more

The Race To Accelerate


Geoff Tate, CEO of [getentity id="22921" e_name="Flex Logix"], sat down with Semiconductor Engineering to discuss how the chip industry is changing, why that bodes well for embedded FPGAs, and what you need to be aware of when using programmable logic on the same die as other devices. What follows are excerpts of that conversation. SE: What are the biggest challenges facing the chip industry... » read more

Building In Functional Safety At The Lowest Hardware Levels Supports Autonomous Driving’s Future


Long before automotive electronic system designers chose artificial intelligence and machine learning as the path toward the future of autonomous driving’s future, it was clear that high-performance computing platforms typically found in data center systems clearly were not going to provide all the answers. Automotive system designers place more emphasis on functional safety and resilience, w... » read more

Week In Review: Design


Acquisitions Marvell signed a definitive agreement to buy Cavium for roughly $6 billion. The deal is expected to close in mid-2018. The Cavium deal fits squarely on the cloud side and gives Marvell a much bigger reach into enterprise networking and infrastructure, as well as some developing markets. Siemens paid an undisclosed price to buy Solido Design Automation, which tracks variation i... » read more

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