designHUB: Design Reuse Made Real


It’s no secret: You can’t get to market quickly or efficiently without integrating and re-using IP technology in your system-on-chip (SoC) design. In the past 10 years alone, design re-use has doubled to the point where today you’ll find more than 150 reused blocks comprising 60-70% of the die area in an average SoC. The companies most successful with their IP-reuse strategies are thos... » read more

Cure The Common Cold…


The technology sector has no equal in the ability of its people to visualize what might be possible and then make it happen fast. If we were sorting out the common cold, the sniffles may already have been relegated to the past. Maybe that’s a claim too far but while imagining the future has always been a feature of our world I think we’ve gone into overdrive in the last few years. From a... » read more

The Week in Review: IoT


Cybersecurity Cybersecurity concerns continued to generate news this week. Symantec reported a corporate espionage hacking campaign against manufacturers of medical supplies, dubbing the efforts “Orangeworm.” The hackers have attacked 24 or more targets this year, and almost 100 since 2015, according to the security software and services firm. Meanwhile, the House Energy and Commerce Co... » read more

The Race To Accelerate


Geoff Tate, CEO of [getentity id="22921" e_name="Flex Logix"], sat down with Semiconductor Engineering to discuss how the chip industry is changing, why that bodes well for embedded FPGAs, and what you need to be aware of when using programmable logic on the same die as other devices. What follows are excerpts of that conversation. SE: What are the biggest challenges facing the chip industry... » read more

Building In Functional Safety At The Lowest Hardware Levels Supports Autonomous Driving’s Future


Long before automotive electronic system designers chose artificial intelligence and machine learning as the path toward the future of autonomous driving’s future, it was clear that high-performance computing platforms typically found in data center systems clearly were not going to provide all the answers. Automotive system designers place more emphasis on functional safety and resilience, w... » read more

Week In Review: Design


Acquisitions Marvell signed a definitive agreement to buy Cavium for roughly $6 billion. The deal is expected to close in mid-2018. The Cavium deal fits squarely on the cloud side and gives Marvell a much bigger reach into enterprise networking and infrastructure, as well as some developing markets. Siemens paid an undisclosed price to buy Solido Design Automation, which tracks variation i... » read more

Making high-capacity data caches more efficient


Source: Researchers from MIT, Intel, and ETH Zurich Xiangyao Yu (MIT), Christopher J. Hughes (Intel), Nadathur Satish (Intel) Onur Mutlu (ETH Zurich), Srinivas Devadas (MIT) Technical Paper link MIT News article As the transistor counts in processors have gone up, the relatively slow connection between the processor and main memory has become the chief impediment to improving comp... » read more

How Neural Networks Think (MIT)


Source: MIT’s Computer Science and Artificial Intelligence Laboratory, David Alvarez-Melis and Tommi S. Jaakkola Technical paper link MIT article General-purpose neural net training Artificial-intelligence research has been transformed by machine-learning systems called neural networks, which learn how to perform tasks by analyzing huge volumes of training data, reminded MIT research... » read more

ARM Moves Further Into Automotive With NXP’s Launch of S32K Series To The General Market


NXP has now launched its new S32K range of microcontrollers for the general market. These devices are targeted at automotive body and motor control applications. NXP is thus now offering ARM-based devices to a broad range of customers in a segment that has been dominated by proprietary-architecture devices. The increasing demands on controllers in body applications mean that this is unlikely to... » read more

New BEOL/MOL Breakthroughs?


Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

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