Week In Review: Manufacturing, Test


Chipmakers Earlier this year, the semiconductor industry saw little merger and acquisition activity. More recently, though, there has been a flurry of deals. In July, ADI moved to acquire Maxim. Then, Nvidia announced plans to acquire Arm for $40 billion, followed by AMD’s proposed move to buy Xilinx for $35 billion. Not to be outdone, Marvell has announced plans to buy Inphi. Companies a... » read more

13-Gb/s Transmitter For Bunch Of Wires Chip-To-Chip Interface Standard


Continuous downscaling of integrated circuits has reached a bottleneck. Technologies such as system in a package, multi-chip module and integration of chips on an active or passive interposer can further improve the system performance. Bunch of wires interface standard was recently introduced for chip to chip short interfaces within a package. This standard required both terminated and untermin... » read more

Week In Review: Manufacturing, Test


Chipmakers TSMC posted mixed results in the quarter, although the news was generally positive. The foundry giant raised its capital spending plans. “Our second quarter business was sequentially flat, as the continued 5G infrastructure deployment and HPC-related product launches offset weaknesses in other platforms,” said Wendell Huang, vice president and CFO at TSMC. “Moving into third q... » read more

Week In Review: IoT, Security, Autos


Internet of Things Sensors that see in the dark, look deep into our faces and hear the impossible, were all part of ams’ CES lineup this week. ams announced that it has designed an advanced spectral ambient light sensor (ALS) for high-end mobile phone cameras. The ALS, called the AS7350, identifies the light source and makes an accurate white balance under low-light and other non-ideal condi... » read more

Manufacturing Bits: Oct. 22


3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

Armv8.5-A Memory Tagging Extension


The Internet worm of 1988 took offline one tenth of the fledgling network, and severely slowed down the remainder [1]. Over 30 years later, two of the most important classes of security vulnerability in code written in C-like languages are still violations of memory safety. According to a 2019 BlueHat presentation, 70% of all security issues addressed in Microsoft products are caused by violati... » read more

Configure, Confirm, Ship: Build Secure Processor-Based Systems with Faster Time-to-Market


Security is a first-order design requirement for processor-based systems. Processor designers implement security functionality directly into the hardware itself to protect the system at its most fundamental layer. System integrators that use processor IP such as Synopsys’ DesignWare ARC processors must ensure that they configure and manage the protection and security features correctly, and t... » read more

Crossover To Memory Expansion With Adesto EcoXiP and NXP’s i.MX RT Crossover Processors


The ‘Crossover Processor’ integrates attributes of a microprocessor such as higher CPU speeds, multimedia interfaces and expandable memory into a microcontroller form factor built for cost effectiveness and fastest development time. This new crossover processor class of device provides embedded developers the ability to solve many problems in today’s fast-moving technology markets. To ... » read more

Testing Post


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Manufacturing Bits: Dec. 18


Gallium oxide breakthroughs Crystalline beta gallium oxide is a promising wide bandgap semiconductor material. It has a large bandgap of 4.8–4.9 eV with a high breakdown field of 8 MV/cm. The technology has a high voltage figure of merit, which is more than 3,000 times greater than silicon, more than 8 times greater than silicon carbide (SiC) and more than 4 times greater than that of... » read more

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