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What Comes Next


By Marc Heyns I’m very optimistic about the continuation of Moore’s Law. But in saying that, I’m speaking about Moore’s Law purely as an economic law. I believe we’ll be able to offer increasing amounts of functionality at lower and lower costs. And technological innovations as well as advances in design and application will be crucial in realizing this. But I don’t believe a ... » read more

Imitation game movie review, fair or foul ?


It’s a bit of a stretch, but seeing as Alan Turing is the original thinker behind this whole industry, I am going to take the liberty of a review of the new movie “Imitation Game”. Prior to raising the curtain on the story of the breaking of the Enigma code during the second world war, Turing was unknown outside the computer science community. He was the original thinker behind the comput... » read more

Defects And Contamination Control


This week’s episode of the new Cosmos was particularly interesting because Neil Degrasse Tyson filled in a part of the recent history of semiconductors and made a great point about ethics in science. I had just moved to the United States when Carl Sagan’s Cosmos first aired, and at the time I thought he connected all sorts of interesting dots. The new edition is even better. In this ... » read more

Are Consortia Fair Competition?


This year’s Super Bowl was rather disappointing, but the NFL has been remarkably successful in creating an environment where all the teams have a path to success. This provides an interesting counter point to the discussion last time on the role of consortia such as IMEC. My point last time was that big problems require big solutions and cooperation between companies and even governments are... » read more

DFM Success At SMIC


Jeff Wilson As any integrated circuit (IC) designer knows, design rules are the “first line of defense” foundries provide in the effort to ensure all IC designs are ultimately manufacturable. Coming in a close second, design for manufacturing (DFM) rules enable designers to maximize design capabilities and performance while minimizing or optimizing the use of chip space. At today’s ad... » read more

Programming The Future


By Joanne Itow After Achronix and Altera made significant announcements involving FPGA products and Intel’s advanced manufacturing technology, I decided to take a closer look at some of the market numbers involved. Just to recap, in February, Achronix announced the company began shipping the first FPGA device manufactured on Intel’s 22nm, Tri-Gate process technology. One week later, Altera... » read more

Experts At The Table: Obstacles In Low-Power Design


By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power design with with Leah Clark, associate technical director at Broadcom; Richard Trihy, director of design enablement at GlobalFoundries; Venki Venkatesh, engineering director at Atrenta; and Qi Wang, technical marketing group director at Cadence. What follows are excerpts of that conversation. LPHP: If you ar... » read more

Wafer Leaders Extend Basis for Global SOI Supply


Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ It’s a bright green light from the world leaders in SOI wafer capacity. Soitec, the world leader in SOI wafer production, and long-time partner Shin-Etsu Handatai (SEH), the world’s biggest producer of silicon wafers, have extended their licensing agreement and expanded their technology cooperation. SEH is a $12... » read more

Lint Your Hardware Description: The Need To Be Fast, Accurate, Scalable And Flexible


A reliable linting tool must be SAFE (Scalable, Accurate, Fast and Extendible) so it can help catch issues early in the design cycle - issues that may be missed by traditional dynamic verification techniques. The main objective of a SAFE linting solution is to reduce costly design iterations, prevent late stage design ECOs and promote seamless reuse of IPs. Such a linting solution will need to ... » read more

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