中文 English

Startup Funding: August 2022 Sortable Funding Chart


Below is a sortable chart that accompanies your e-book purchase of Semiconductor Engineering's August 2022. Startup Funding report.  Simply click on the top headers to determine your primary sort. [table id=52 /] The complete ebook (over 40 pages) can be found here. » read more

FICS Research Institute: Detailed Assessment of the PQC Candidates To Power Side Channel Attacks


New research paper by a team of researchers from FICS Research Institute titled "PQC-SEP: Power Side-Channel Evaluation Platform for Post-Quantum Cryptography Algorithms." Abstract "Research in post-quantum cryptography (PQC) aims to develop cryptographic algorithms that can withstand classical and quantum attacks. The recent advance in the PQC field has gradually switched from the theory t... » read more

Image Sensor Trained To Classify Optically Projected Images By Reading Out The Few Most Relevant Pixels


New research paper "Sparse pixel image sensor" from Institute of Photonics, Vienna University of Technology. Abstract "As conventional frame-based cameras suffer from high energy consumption and latency, several new types of image sensors have been devised, with some of them exploiting the sparsity of natural images in some transform domain. Instead of sampling the full image, those devices... » read more

Week In Review: Manufacturing, Test


Onshoring and the supply chain Efforts to patch up supply chain weaknesses by moving more manufacturing onshore in the United States and Europe are generating a lot of buzz. Morris Chang, TMSC's founder, described those moves as "a very expensive exercise in futility," during an interview with the Brookings Institution and Center for Strategic and International Studies, adding that it is like... » read more

Hardware Countermeasures Benchmarking against Fault Attacks


Abstract "The development of differential fault analysis (DFA) techniques and mechanisms to inject faults into cryptographic circuits brings with it the need to use protection mechanisms that guarantee the expected level of security. The AES cipher, as a standard, has been the target of numerous DFA techniques, where its security has been compromised through different formulations and types of... » read more

Complex Chips Make Security More Difficult


Semiconductor supply chain management is becoming more complex with many more moving parts as chips become increasingly disaggregated, making it difficult to ensure where parts originated and whether they have been compromised before they are added into advanced chips or packages. In the past, supply chain concerns largely focused primarily on counterfeit parts or gray-market substitutions u... » read more

Vertical MoS2 transistors with sub-1-nm gate lengths


Abstract "Ultra-scaled transistors are of interest in the development of next-generation electronic devices. Although atomically thin molybdenum disulfide (MoS2) transistors have been reported, the fabrication of devices with gate lengths below 1 nm has been challenging. Here we demonstrate side-wall MoS2 transistors with an atomically thin channel and a physical gate length of sub-1 nm ... » read more

Advances in Logic Locking: Past, Present, and Prospects


Abstract: "Logic locking is a design concealment mechanism for protecting the IPs integrated into modern System-on-Chip (SoC) architectures from a wide range of hardware security threats at the IC manufacturing supply chain. Logic locking primarily helps the designer to protect the IPs against reverse engineering, IP piracy, overproduction, and unauthorized activation. For more than a decade,... » read more

Hardware Root of Trust: Everything You Need To Know


As explained in our “Secure Silicon IP Webinar Series“, a root of trust is the security foundation for an SoC, other semiconductor device or electronic system. However, its meaning differs depending on who you ask. For example, the hardware root of trust contains the keys for cryptographic functions and is usually a part of the secure boot process providing the foundation for the software c... » read more

A Novel Multifunctional Single-Layer Adhesive Used For Both Temporary Bonding And Mechanical Debonding in Wafer-Level Packaging Applications


Temporary bonding (TB) and debonding (DB) of wafers have been widely developed and applied over the last decade in various wafer-level packaging technologies, such as package-on-package (PoP), fan-out integration, and 2.5D and 3D integration using through-silicon vias (TSVs). The materials used to achieve TB and DB are extremely critical and the industry's current best practice is the use of tw... » read more

← Older posts